发明申请
- 专利标题： PACKAGE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF
- 专利标题（中）： 具有MEMS元件的封装及其制造方法
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申请号： US13170424申请日： 2011-06-28
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公开(公告)号： US20120286425A1公开(公告)日： 2012-11-15
- 发明人: Chang-Yueh Chan , Chien-Ping Huang , Chun-Chi Ke , Shih-Kuang Chiu
- 申请人： Chang-Yueh Chan , Chien-Ping Huang , Chun-Chi Ke , Shih-Kuang Chiu
- 申请人地址： TW Taichung
- 专利权人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人地址： TW Taichung
- 优先权： TW100116620 20110512
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/56
摘要：
A package structure having an MEMS element is provided, which includes: a protection layer having openings formed therein; conductors formed in the openings, respectively; conductive pads formed on the protection layer and the conductors; a MEMS chip disposed on the conductive pads; and an encapsulant formed on the protection layer for encapsulating the MEMS chip. By disposing the MEMS chip directly on the protection layer to dispense with the need for a carrier, such as a wafer or a circuit board that would undesirably add to the thickness, the present invention reduces the overall thickness of the package to thereby achieve miniaturization.
公开/授权文献
- US08653661B2 Package having MEMS element and fabrication method thereof 公开/授权日：2014-02-18