发明申请
- 专利标题： INFRARED INSPECTION OF BONDED SUBSTRATES
- 专利标题（中）： 红外检测粘结基板
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申请号： US13510135申请日： 2010-11-16
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公开(公告)号： US20120287263A1公开(公告)日： 2012-11-15
- 发明人: Wei Zhou
- 申请人： Wei Zhou
- 申请人地址： US NJ Flanders
- 专利权人： Rudolph Technologies, Inc.
- 当前专利权人： Rudolph Technologies, Inc.
- 当前专利权人地址： US NJ Flanders
- 国际申请： PCT/US2010/056785 WO 20101116
- 主分类号： H04N7/18
- IPC分类号： H04N7/18 ; H01L29/26
摘要：
A method and apparatus for obtaining inspection information is described. A standard CCD or CMOS camera is used to obtain images in the near infrared region. Background and noise components of the obtained image are removed and the signal to noise ratio is increased to provide information that is suitable for use in inspection.
信息查询
