发明申请
- 专利标题: METHOD FOR PROCESSING CIRCUIT IN PACKAGE
- 专利标题(中): 用于处理包装中的电路的方法
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申请号: US13105909申请日: 2011-05-12
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公开(公告)号: US20120288967A1公开(公告)日: 2012-11-15
- 发明人: Ming-Teng Hsieh , Yi-Nan Chen , Hsien-Wen Liu
- 申请人: Ming-Teng Hsieh , Yi-Nan Chen , Hsien-Wen Liu
- 主分类号: H01L21/30
- IPC分类号: H01L21/30 ; H01L21/306
摘要:
A method for decapsulating an integrated circuit package without the need of using a mask during the decapsulation process is disclosed. First, a package is provided. The package includes at least a circuit element and a molding compound enclosing the circuit. Second, a caustic solution is simultaneously provided. The caustic solution is capable of etching the molding compound and intermittently contacts a pre-selected area of the molding compound to etch the molding compound. As a consequence, the caustic solution removes the molding compound in the pre-selected area so the circuit element in the package is substantially exposed.