发明申请
- 专利标题： Dislocation Engineering Using a Scanned Laser
- 专利标题（中）： 使用扫描激光的位错工程
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申请号： US13565018申请日： 2012-08-02
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公开(公告)号： US20120294322A1公开(公告)日： 2012-11-22
- 发明人: Chung Woh Lai , Xiao Hu Liu , Anita Madan , Klaus W. Schwarz , J. Campbell Scott
- 申请人： Chung Woh Lai , Xiao Hu Liu , Anita Madan , Klaus W. Schwarz , J. Campbell Scott
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01S3/10
- IPC分类号： H01S3/10
摘要：
A system for manipulating dislocations on semiconductor devices, includes a moveable laser configured to generate a laser beam locally on a surface portion of the semiconductor body having a plurality of dislocations, the moveable laser being characterized as having a scan speed, the moveable laser manipulates the plurality of dislocations on the surface portion of the semiconductor body by adjusting the temperature and the scan speed of the laser beam.