发明申请
- 专利标题： CIRCUIT BOARD, DISPLAY DEVICE, AND PROCESS FOR PRODUCTION OF CIRCUIT BOARD
- 专利标题（中）： 电路板，显示装置及电路板生产工艺
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申请号： US13522778申请日： 2010-10-25
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公开(公告)号： US20120298988A1公开(公告)日： 2012-11-29
- 发明人: Yoshihito Hara , Yukinobu Nakata
- 申请人： Yoshihito Hara , Yukinobu Nakata
- 申请人地址： JP Osaka-shi, Osaka
- 专利权人： Sharp Kabushiki Kaisha
- 当前专利权人： Sharp Kabushiki Kaisha
- 当前专利权人地址： JP Osaka-shi, Osaka
- 优先权： JP2010-011368 20100121
- 国际申请： PCT/JP2010/068803 WO 20101025
- 主分类号： H01L33/08
- IPC分类号： H01L33/08 ; H01L21/336
摘要：
The present invention provides a highly reliable circuit board that includes TFTs a semiconductor layer of which is formed from an oxide semiconductor; and low-resistance aluminum wirings. The circuit board of the present invention includes an oxide semiconductor layer; source wirings; and drain wirings, wherein each of the source wirings and the drain wirings includes a portion in contact with the semiconductor layer, portions of the source wirings in contact with the semiconductor layer and respective portions of the drain wirings in contact with the semiconductor layer spacedly facing each other, and the source wirings and the drain wirings are formed by stacking a layer formed from a metal other than aluminum and a layer containing aluminum.
公开/授权文献
- US08778730B2 Process for production of circuit board 公开/授权日：2014-07-15
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