发明申请
- 专利标题: VACUUM PROCESS DEVICE AND VACUUM PROCESS METHOD
- 专利标题(中): 真空过程装置和真空过程方法
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申请号: US13479518申请日: 2012-05-24
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公开(公告)号: US20120303158A1公开(公告)日: 2012-11-29
- 发明人: Teruo NAKATA , Keita Nogi , Satomi Inoue , Michinori Kawaguchi
- 申请人: Teruo NAKATA , Keita Nogi , Satomi Inoue , Michinori Kawaguchi
- 优先权: JP2011-117755 20110526
- 主分类号: H01L21/677
- IPC分类号: H01L21/677 ; G06F7/00
摘要:
An efficient method of controlling transportation in a linear tool type vacuum process device in a state that a length of time required for a process is not stable. For each process chamber, the number of unprocessed wafers that are in process or are being transported to the process chamber is counted, and in deciding a transport destination of a wafer, when the number of unprocessed wafers is equal to or larger than a charge limit amount, a transport destination of a wafer is decided excluding the process chamber. Also, a wafer holding mechanism on a transport path to a process chamber is reserved, and a transport destination of a processed member to be transported next is decided according to a status of reservation.
公开/授权文献
- US08812151B2 Vacuum process device and vacuum process method 公开/授权日:2014-08-19
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