发明申请
- 专利标题： HEATED WAFER CARRIER PROFILING
- 专利标题（中）： 加热滚筒载体轮廓
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申请号： US13483354申请日： 2012-05-30
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公开(公告)号： US20120304926A1公开(公告)日： 2012-12-06
- 发明人: Vadim Boguslavskiy , Joshua Mangum , Matthew King , Earl Marcelo , Eric A. Armour , Alexander I. Gurary , William E. Quinn , Guray Tas
- 申请人： Vadim Boguslavskiy , Joshua Mangum , Matthew King , Earl Marcelo , Eric A. Armour , Alexander I. Gurary , William E. Quinn , Guray Tas
- 申请人地址： US NY Plainview
- 专利权人： VEECO INSTRUMENTS INC.
- 当前专利权人： VEECO INSTRUMENTS INC.
- 当前专利权人地址： US NY Plainview
- 主分类号： C23C16/52
- IPC分类号： C23C16/52 ; G01H1/00 ; G01J5/00 ; G01N21/956 ; G01J5/02
摘要：
An apparatus includes a carrier rotatable about an axis of rotation where the carrier has a top surface adapted to hold at least one semiconductor wafer and a surface characterization tool which is operative to move over a plurality of positions relative to the top surface of the carrier and/or the wafer transverse to the axis of rotation. The surface characterization tool is operative to move over a plurality of positions relative to the top surface of the carrier and/or the wafer transverse to the axis of rotation and is further adapted to produce characterization signals over the plurality of positions on at least a portion of the carrier and/or on at least a portion of said major surface of the wafer as the carrier rotates.
公开/授权文献
- US09653340B2 Heated wafer carrier profiling 公开/授权日：2017-05-16
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