发明申请
US20120305771A1 Proximity Sensor Packaging Structure And Manufacturing Method Thereof
审中-公开
接近传感器封装结构及其制造方法
- 专利标题: Proximity Sensor Packaging Structure And Manufacturing Method Thereof
- 专利标题(中): 接近传感器封装结构及其制造方法
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申请号: US13578601申请日: 2011-02-10
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公开(公告)号: US20120305771A1公开(公告)日: 2012-12-06
- 发明人: Lu-Ming Lai
- 申请人: Lu-Ming Lai
- 申请人地址: TW New Taipei City
- 专利权人: EVERLIGHT ELECTRONICS CO., LTD.
- 当前专利权人: EVERLIGHT ELECTRONICS CO., LTD.
- 当前专利权人地址: TW New Taipei City
- 优先权: CN201010128176.7 20100212
- 国际申请: PCT/CN2011/070904 WO 20110210
- 主分类号: H01L31/16
- IPC分类号: H01L31/16 ; H01L31/18
摘要:
The present invention pertains to a proximity sensor packaging structure, which comprises a substrate, two first electrically conductive layers and a plurality of second electrically conductive layers that are disposed on the substrate. The substrate has first and second grooves that are respectively defined by a bottom surface and an interior sidewall. Each electrically conductive layer extends from a bottom surface of the first groove, along the interior sidewall of the first groove and in an opposite direction relative to the other first electrically conductive layer, to an exterior sidewall of the substrate. The second electrically conductive layers include first and second electrically conductive portions. The first electrically conductive portion is disposed on a central region of the bottom surface of the second groove. The second electrically conductive portion extends from the bottom surface of the second groove, along the interior sidewall thereof, to the exterior sidewall of the substrate.