摘要:
A light-emitting diode (LED) element including an LED chip having a light emitting surface and at least one pad. A phosphor layer is formed on the light emitting surface and exposes the at least one pad. The phosphor layer includes a plurality of phosphor particles and a matrix. At least some of the phosphor particles have a first portion embedded in the matrix and a second portion protruding from an outer surface of the matrix. A method of forming a gel layer on an LED element includes using capillary action to draw the glue material into a space adjacent the upper surface of the chip.
摘要:
The present invention pertains to a proximity sensor packaging structure, which comprises a substrate, two first electrically conductive layers and a plurality of second electrically conductive layers that are disposed on the substrate. The substrate has first and second grooves that are respectively defined by a bottom surface and an interior sidewall. Each electrically conductive layer extends from a bottom surface of the first groove, along the interior sidewall of the first groove and in an opposite direction relative to the other first electrically conductive layer, to an exterior sidewall of the substrate. The second electrically conductive layers include first and second electrically conductive portions. The first electrically conductive portion is disposed on a central region of the bottom surface of the second groove. The second electrically conductive portion extends from the bottom surface of the second groove, along the interior sidewall thereof, to the exterior sidewall of the substrate.
摘要:
A tilt sensor including a body, an LED, a first photosensitive device, a second photosensitive device, and a moving thin-element is provided. The body has a movement region, a first containing region, a second containing region, and a third containing region. The first, second, and third containing regions have an opening respectively and are connected with the movement region through the openings. The LED providing a light beam is disposed in the first containing region. The first and second photosensitive devices are disposed in the second and third containing regions respectively. When the body tilts toward different tilt directions, the moving thin-element moves in the tilt direction, allowing the light beam provided from the LED to reflect directly to the first and second photosensitive devices, or shielding the light beam provided from the LED from being transmitted to the first and second photosensitive devices.
摘要:
A photoelectric transmitting or receiving device comprises a substrate, a first conductive layer, a second conductive layer and a photoelectric transducing chip. The substrate has an upper surface and a recess and is made of a composite material. The first conductive layer and the second conductive layer are formed by using laser to activate the composite material of the substrate. The first conductive layer is disposed on the bottom surface of the recess, and is extended outwardly along the inner lateral wall of the recess and the upper surface of the substrate. The second conductive layer is electrically insulated from the first conductive layer and is extended outwardly along the upper surface of the substrate. The photoelectric transducing chip is disposed on the bottom surface of the recess and electrically connected to the first conductive layer and to the second conductive layer, respectively.
摘要:
A tilt sensor includes a body, a light emitting diode (LED), a first photosensitive element, a second photosensitive element, and a moving element. The body can tilt in a plurality of tilt directions. The LED is disposed at the body for providing a light beam. The first photosensitive element is disposed at the body and at the opposite side of the LED. The second photosensitive element is disposed at the body and at another side of the LED. The moving element is disposed at the body. When the body tilts toward different tilt directions, the moving element moves toward different directions so that different light receiving situations are produced.
摘要:
A tilt sensor including a body, a plurality of metal pad pairs, and a moving element is provided. The body is suitable for tilting in a plurality of tilt directions and has a movement region having a plurality of corners. The metal pad pairs are respectively located in at least a portion of the corners. The moving element is located in the movement region. The moving element moves to one of the corners and physically contacts with the metal pad pair located in the corner when the body tilts towards one of the tilt directions, such that the metal pads of the metal pad pair are electrically connected with each other via the moving element.
摘要:
A tilt sensor includes a body, a light emitting device, a first photosensitive device, a second photosensitive device, and a moving element. The body can tilt in a plurality of tilt directions. The light emitting device is disposed at the body for providing a light beam. The first photosensitive device is disposed at the body and at one side of the light emitting device. The second photosensitive device is disposed at the body and at another side of the light emitting device. The moving element is disposed at the body. When the body tilts toward different tilt directions, the moving element moves toward different tilt directions so that the light beam emitted by the light emitting device directly transmits to the first photosensitive device and the second photosensitive device or is sheltered from directly transmitting to at least one of the first photosensitive device and the second photosensitive device.
摘要:
A tilt sensor including a body, an LED, a first photosensitive device, a second photosensitive device, and a moving thin-element is provided. The body has a movement region, a first containing region, a second containing region, and a third containing region. The first, second, and third containing regions have an opening respectively and are connected with the movement region through the openings. The LED providing a light beam is disposed in the first containing region. The first and second photosensitive devices are disposed in the second and third containing regions respectively. When the body tilts toward different tilt directions, the moving thin-element moves in the tilt direction, allowing the light beam provided from the LED to reflect directly to the first and second photosensitive devices, or shielding the light beam provided from the LED from being transmitted to the first and second photosensitive devices.
摘要:
A photoelectric transmitting or receiving device and the manufacturing method thereof are provided. The photoelectric transmitting device comprises a substrate, a first conductive layer, a second conductive layer and a photoelectric transducing chip. The substrate has an upper surface and a recess and is made of a composite material. The recess is defined by a bottom surface and an inner lateral wall extended upwardly from the bottom surface to the upper surface. The first conductive layer and the second conductive layer are formed by using laser to activate the composite material of the substrate. The first conductive layer is disposed on the bottom surface of the recess, and is extended outwardly along the inner lateral wall of the recess and the upper surface of the substrate. The second conductive layer is electrically insulated from the first conductive layer and is extended outwardly along the upper surface of the substrate. The photoelectric transducing chip is disposed on the bottom surface of the recess and electrically connected to the first conductive layer disposed on the bottom surface of the recess and to the second conductive layer, respectively.
摘要:
A photo-coupler is provided. The photo-coupler comprises a light emitting chip, a light-sensing chip, a light-transmissive inner encapsulant package and an outer package. Both the light emitting chip and the light-sensing chip face the same direction, while the light-sensing chip receives a light beam emitted by the light emitting chip. The light-transmissive inner encapsulant package encloses the light emitting chip and the light-sensing chip, while the outer package encloses the light-transmissive inner encapsulant package. An interface is formed between the light-transmissive inner encapsulant package and the outer package for reflecting the light beam. A reflective curve surface adjacent to the light emitting chip is formed on the interface of the light-transmissive inner encapsulant package for reflecting and converging the first portion of the light beam to the light-sensing chip.