发明申请
- 专利标题： LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM
- 专利标题（中）： 发光装置包装和照明系统
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申请号： US13412024申请日： 2012-03-05
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公开(公告)号： US20120305962A1公开(公告)日： 2012-12-06
- 发明人: Sunghee WON , Youngsu Chun
- 申请人： Sunghee WON , Youngsu Chun
- 优先权： KR10-2011-0051340 20110530
- 主分类号： H01L33/50
- IPC分类号： H01L33/50 ; H01L33/62
摘要：
A light emitting device package is disclosed. The light emitting device package includes a light emitting device disposed on a first lead frame, the light emitting device having an electrode pad on an upper surface thereof, a first wire to electrically interconnect a second lead frame spaced apart from the first lead frame and the electrode pad, and a first bonding ball disposed on the second lead frame, the first bonding ball spaced apart from a first contact point, which is in contact with the first wire and the second lead frame, wherein the first bonding ball is disposed between the first wire and the second lead frame to electrically interconnect the first wire and the second lead frame.
公开/授权文献
- US08492786B2 Light emitting device package and lighting system 公开/授权日：2013-07-23
信息查询
IPC分类:
