发明申请
- 专利标题： ELECTRONIC MODULE
- 专利标题（中）： 电子模块
-
申请号： US13584988申请日： 2012-08-14
-
公开(公告)号： US20120306069A1公开(公告)日： 2012-12-06
- 发明人: Stefan Landau , Erwin Huber , Josef Hoeglauer , Joachim Mahler , Tino Karczeweski
- 申请人： Stefan Landau , Erwin Huber , Josef Hoeglauer , Joachim Mahler , Tino Karczeweski
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
An electronic module. One embodiment includes a carrier. A first transistor is attached to the carrier. A second transistor is attached to the carrier. A first connection element includes a first planar region. The first connection element electrically connects the first transistor to the carrier. A second connection element includes a second planar region. The second connection element electrically connects the second transistor to the carrier. In one embodiment, a distance between the first planar region and the second planar region is smaller than 100 μm.
公开/授权文献
- US08836113B2 Electronic module 公开/授权日：2014-09-16
信息查询
IPC分类:
