发明申请
- 专利标题： Oxygen-Barrier Packaged Surface Mount Device
- 专利标题（中）： 氧阻隔封装表面贴装器件
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申请号： US13153368申请日： 2011-06-03
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公开(公告)号： US20120307467A1公开(公告)日： 2012-12-06
- 发明人: Luis A. Navarro , Mario G. Sepulveda , Patrick J. Hibbs , Martin G. Pineda , Martyn A. Matthiesen , Anthony Vranicar , Dong Yu
- 申请人： Luis A. Navarro , Mario G. Sepulveda , Patrick J. Hibbs , Martin G. Pineda , Martyn A. Matthiesen , Anthony Vranicar , Dong Yu
- 主分类号： H05K7/10
- IPC分类号： H05K7/10 ; B32B38/10
摘要：
An electrical component includes a plurality of core devices arranged within a housing so as to be electrically isolated from one another. For each of the plurality of core devices, a first contact pad and a second contact pad is formed on an outside surface of the housing. The first and second contact pads are electrically connected to a respective core device of the plurality of core devices.
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