发明申请
- 专利标题: COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC PART
- 专利标题(中): 电力电子部件铜合金板
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申请号: US13585076申请日: 2012-08-14
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公开(公告)号: US20120308429A1公开(公告)日: 2012-12-06
- 发明人: Yasuhiro ARUGA , Ryoichi Ozaki , Yosuke Miwa
- 申请人: Yasuhiro ARUGA , Ryoichi Ozaki , Yosuke Miwa
- 申请人地址: JP Kobe-shi
- 专利权人: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
- 当前专利权人: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
- 当前专利权人地址: JP Kobe-shi
- 优先权: JP2006-199777 20060721; JP2006-199778 20060721; JP2006-199779 20060721; JP2007-129468 20070515
- 主分类号: C22C9/02
- IPC分类号: C22C9/02
摘要:
A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width β of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 μm or less.
公开/授权文献
- US09644250B2 Copper alloy sheet for electric and electronic part 公开/授权日:2017-05-09