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公开(公告)号：US20140193293A1
公开(公告)日：2014-07-10
申请号：US14127724
申请日：2011-08-04
IPC分类号： H01B1/02
摘要： Disclosed is a copper alloy containing 1.0% to 3.6% of Ni, 0.2% to 1.0% of Si, 0.05% to 3.0% of Sn, 0.05% to 3.0% of Zn, with the remainder including copper and inevitable impurities. The copper alloy has an average grain size of 25 pm or less and has a texture having an average area percentage of cube orientation of 20% to 60% and an average total area percentage of brass orientation, S orientation and copper orientation of 20% to 50%. The copper alloy has a KAM value of 0.8 to 3.0 and does not suffer from cracking even when subjected to U-bending. The copper alloy has excellent balance between strengths (particularly yield strength in a direction perpendicular to the rolling direction) and bending workability.
摘要翻译： 公开了含有1.0％至3.6％的Ni，0.2％至1.0％的Si，0.05％至3.0％的Sn，0.05％至3.0％的Zn，其余包括铜和不可避免的杂质的铜合金。 铜合金的平均粒径为25μm以下，具有立方取向平均面积百分比为20〜60％，黄铜取向，S取向和铜取向的平均面积百分比为20％〜 50％。 铜合金的KAM值为0.8〜3.0，即使经受U形弯曲也不会发生龟裂。 铜合金在强度（特别是与轧制方向垂直的方向上的屈服强度）和弯曲加工性之间具有优异的平衡。
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2.发明授权Copper alloy plate for electric and electronic parts having bending workability 有权具有弯曲加工性能的电气电子部件用铜合金板公开(公告)号：US08715431B2
公开(公告)日：2014-05-06
申请号：US11573041
申请日：2005-08-11
申请人： Yasuhiro Aruga , Katsura Kajihara
发明人： Yasuhiro Aruga , Katsura Kajihara
CPC分类号： H01L23/49579 , C22C9/00 , C22C9/02 , H01L2924/0002 , H01L2924/3011 , H05K1/09 , H05K2201/0355 , H01L2924/00
摘要： A Cu—Fe—P copper alloy sheet which has the high strength and the high electrical conductivity compatible with excellent bendability is provided. The Cu—Fe—P copper alloy sheet contains 0.01% to 3.0% of Fe and 0.01% to 0.3% of P on a percent by mass basis, wherein the orientation density of the Brass orientation is 20 or less and the sum of the orientation densities of the Brass orientation, the S orientation, and the Copper orientation is 10 or more and 50 or less in the microstructure of the copper alloy sheet.
摘要翻译： 提供了具有高强度和高导电性的Cu-Fe-P铜合金板，具有优异的弯曲性。 Cu-Fe-P铜合金板含有0.01％〜3.0％的Fe和0.01〜0.3％的P，以质量计为基准，其中黄铜取向的取向密度为20以下， 黄铜取向的密度，S取向和铜取向在铜合金板的组织中为10以上且50以下。
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3.发明申请COPPER ALLOY HAVING HIGH STRENGTH, HIGH ELECTRIC CONDUCTIVITY AND EXCELLENT BENDING WORKABILITY 审中-公开铜合金具有高强度，高电导率和优异的弯曲工作性能公开(公告)号：US20130045130A1
公开(公告)日：2013-02-21
申请号：US13491942
申请日：2012-06-08
申请人： Yasuhiro ARUGA , Akira FUGONO , Takeshi KUDO , Katsura KAJIHARA
发明人： Yasuhiro ARUGA , Akira FUGONO , Takeshi KUDO , Katsura KAJIHARA
CPC分类号： H01B1/026 , C22C1/06 , C22C9/00 , C22C9/02 , C22C9/06 , C22C9/10 , C22F1/00 , C22F1/08 , H01H1/025
摘要： The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer.
摘要翻译： 本发明涉及一种具有高强度，高导电性和优异的弯曲性的铜合金，铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。
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公开(公告)号：US20120227870A1
公开(公告)日：2012-09-13
申请号：US13403370
申请日：2012-02-23
摘要： An aluminum-alloy sheet includes 0.10 to 0.40 mass % of Si, 0.35 to 0.80 mass % of Fe, 0.10 to 0.35 mass % of Cu, 0.20 to 0.80 mass % of Mn, and 1.5 to 2.5 mass % of Mg, the balance being Al and unavoidable impurities, wherein a content ratio (Si/Fe) of the Si to the Fe is 0.75 or less, the solute Mn content is 0.12 to 0.20 mass %, and the aluminum-alloy sheet has a proof stress of 225 N/mm2 or more after having been baked at 270° C. for 20 seconds.
摘要翻译： 铝合金板包括Si：0.10〜0.40质量％，Fe：0.35〜0.80质量％，Cu：0.10〜0.35质量％，Mn：0.20〜0.80质量％，Mg：1.5〜2.5质量％ Al和不可避免的杂质，其中Si与Fe的含量比（Si / Fe）为0.75以下，溶质Mn含量为0.12〜0.20质量％，铝合金板的抗应力为225N / 在270℃下烘烤20秒后，mm2以上。
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公开(公告)号：US20110223056A1
公开(公告)日：2011-09-15
申请号：US12672092
申请日：2008-07-24
申请人： Yasuhiro Aruga , Daisuke Hashimoto , Koya Nomura
发明人： Yasuhiro Aruga , Daisuke Hashimoto , Koya Nomura
摘要： The present invention relates to a Cu—Ni—Sn—P-based copper alloy sheet having a specific composition, where (1) the copper alloy sheet is set to have an electrical conductivity of 32% IACS or more, a stress relaxation ratio in the direction parallel to the rolling direction of 15% or less, a 0.2%-proof stress of 500 MPa or more and an elongation of 10% or more; (2) the X-ray diffraction intensity ratio I(200)/I(220) in the sheet surface is set to be a given value or less and at the same time, anisotropy in the stress relaxation resistance characteristic is reduced by fining the grain size; (3) the texture of the copper alloy sheet is set to a texture such that the distribution density of B orientation and the sum of distribution densities of B orientation, S orientation and Cu orientation each is set to fall in a specific range and bendability is thereby enhanced; or (4) the dislocation density measured using the value obtained by dividing the half-value breadth of the X-ray diffraction intensity peak from {200} plane in the copper alloy sheet surface by the peak height is set to a given value or more and press punchability is thereby enhanced. The Cu—Ni—Sn—P-based copper alloy sheet of the present invention is excellent in the properties required for a terminal or connector and further (1) has excellent strength-ductility balance, (2) satisfies the stress relaxation resistance characteristic in the direction orthogonal to the rolling direction, (3) has excellent bendability, or (4) has excellent press punchability.
摘要翻译： 本发明涉及具有特定组成的Cu-Ni-Sn-P系铜合金板，其中（1）铜合金板的导电率设定为32％IACS以上，应力松弛率 平行于轧制方向的方向为15％以下，0.2％以上的应力为500MPa以上，伸长率为10％以上。 （2）将片材表面的X射线衍射强度比I（200）/ I（220）设定为规定值以下，同时，耐应力松弛特性的各向异性通过使 晶粒大小; （3）将铜合金板的织构设定为使得B取向的分布密度和B取向，S取向和Cu取向的分布密度之和各自落在特定范围内，弯曲性为 从而增强; 或（4）使用通过将铜合金板表面中的{200}面的X射线衍射强度峰值的半值宽度除以峰高而得到的值而测定的位错密度设定为规定值以上 从而增强了冲压性。 本发明的Cu-Ni-Sn-P系铜合金板的端子或连接器的特性优异，（1）具有优异的强度 - 延展性平衡，（2）满足 与轧制方向正交的方向，（3）具有优异的弯曲性，或者（4）具有优异的冲压冲压性。
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6.发明申请公开(公告)号：US20090053099A1
公开(公告)日：2009-02-26
申请号：US11909665
申请日：2006-03-07
IPC分类号： C22C21/08
摘要： An aluminum alloy sheet for bottle cans superior in high-temperature properties and capable of preventing thermal deformation thereof in coating and heat treatment and securing can strength after the heat treatment. The aluminum alloy sheet has the following composition: Mn 0.7-1.5%, Mg 0.8-1.7%, Fe 0.1-0.7%, Si 0.05-0.5%, Cu 0.1-0.6%, with the remainder being Al and inevitable impurities, and has a crystal structure elongated in a rolling direction and with an aspect ratio of crystal grains of 3 or more as determined through an examination from above of a part located at the center in the through-thickness direction. In the sheet, the amount of solute Cu is 0.05-0.3%, which means the amount of Cu in a solution separated from a precipitate exceeding 0.2 m in particle size by the extracted residue method using hot phenol, and the amount of solute Mg is 0.75-1.6%, which means the amount of solute Mg separated from a precipitate exceeding 0.2 m in particle size by the extracted residue method using hot phenol. The aluminum alloy sheet can have improved high-temperature properties without impairing its formability.
摘要翻译： 一种用于高温性能优异且能够防止其热涂覆和热处理和固化的热变形的瓶罐用铝合金板，可以在热处理后具有强度。 铝合金板具有以下组成：Mn 0.7-1.5％，Mg 0.8-1.7％，Fe 0.1-0.7％，Si 0.05-0.5％，Cu 0.1-0.6％，其余为Al和不可避免的杂质，并具有 通过从位于贯穿厚度方向的中心的部分的上方检查确定的，在轧制方向上延伸的晶体结构和晶粒的纵横比为3以上。 在片材中，溶质Cu的量为0.05〜0.3％，这意味着通过使用热苯酚的提取残渣法从沉淀超过0.2μm的析出物中分离出的溶液中的Cu的量，溶质Mg的量为 0.75-1.6％，这意味着通过使用热苯酚的提取残留方法从沉淀超过0.2μm的沉淀物中分离出的溶质Mg的量。 铝合金板可以具有改善的高温性能而不损害其成形性。
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公开(公告)号：US20080025867A1
公开(公告)日：2008-01-31
申请号：US11756117
申请日：2007-05-31
申请人： Yasuhiro ARUGA , Ryoichi Ozaki , Katsura Kajihara
发明人： Yasuhiro ARUGA , Ryoichi Ozaki , Katsura Kajihara
IPC分类号： C22C9/02
CPC分类号： C22C9/02 , C22C9/00 , C22C9/04 , C22F1/08 , H01L23/49579 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a Cu—Fe—P alloy capable of enabling high strength, high electrical conductivity, and excellent softening resistance to coexist. The Cu—Fe—P alloy is suitable for use as a constituent material of a lead frame for a semiconductor device. With the Cu—Fe—P alloy with strength rendered higher by micronizing Fe-containing compounds, when enhancing softening resistance by increasing Sn content so as to exceed 0.5 mass %, at least one element selected from the group consisting of Ni, Mg, Ca, Al, Si, and Cr, in trace amounts, are caused to be additionally contained to thereby check cracking likely to occur at the time of forging and hot rolling in a process of producing the copper alloy, as a result of an increase in the Sn content.
摘要翻译： 公开了能够实现高强度，高导电性和优异的耐软化性共存的Cu-Fe-P合金。 Cu-Fe-P合金适用于半导体器件的引线框架的构成材料。 对于通过使含Fe化合物微粉化而使强度提高的Cu-Fe-P合金，当通过使Sn含量增加超过0.5质量％来提高耐软化性时，选自Ni，Mg，Ca ，Al，Si和Cr的微量添加，从而可以检测在铜合金的制造过程中在锻造和热轧时容易发生的裂纹，结果是 Sn含量。
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公开(公告)号：US09671182B2
公开(公告)日：2017-06-06
申请号：US12254345
申请日：2008-10-20
申请人： Toshiaki Takagi , Yasuhiro Aruga , Mamoru Nagao , Takashi Shirai , Masato Watanabe , Akihiko Ishibashi
发明人： Toshiaki Takagi , Yasuhiro Aruga , Mamoru Nagao , Takashi Shirai , Masato Watanabe , Akihiko Ishibashi
摘要： The present invention provides a copper alloy tube for heat exchangers which is tolerable to a high operating pressure of new cooling media such as carbon dioxide and HFC-based fluorocarbons, and is excellent in fracture strength, even if the tube is thinned, and a copper alloy tube for a heat exchanger which has a composition having specified amounts of Sn and P, has an average crystal grain size of 30 μm or less and has a high strength of 250 MPa or more of a tensile strength in the longitudinal direction of the tube improves the fracture strength as a texture in which the orientation distribution density in the Goss orientation is 4% or less.
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公开(公告)号：US09644250B2
公开(公告)日：2017-05-09
申请号：US13585076
申请日：2012-08-14
申请人： Yasuhiro Aruga , Ryoichi Ozaki , Yosuke Miwa
发明人： Yasuhiro Aruga , Ryoichi Ozaki , Yosuke Miwa
CPC分类号： C22C9/00 , C22C9/02 , C22C9/04 , C22F1/00 , C22F1/08 , H01L2924/0002 , H05K1/09 , H05K2201/0355 , H01L2924/00
摘要： A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width β of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 μm or less.
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公开(公告)号：US09546411B2
公开(公告)日：2017-01-17
申请号：US13403370
申请日：2012-02-23
摘要： An aluminum-alloy sheet includes 0.10 to 0.40 mass % of Si, 0.35 to 0.80 mass % of Fe, 0.10 to 0.35 mass % of Cu, 0.20 to 0.80 mass % of Mn, and 1.5 to 2.5 mass % of Mg, the balance being Al and unavoidable impurities, wherein a content ratio (Si/Fe) of the Si to the Fe is 0.75 or less, the solute Mn content is 0.12 to 0.20 mass %, and the aluminum-alloy sheet has a proof stress of 225 N/mm2 or more after having been baked at 270° C. for 20 seconds.
摘要翻译： 铝合金板包括Si：0.10〜0.40质量％，Fe：0.35〜0.80质量％，Cu：0.10〜0.35质量％，Mn：0.20〜0.80质量％，Mg：1.5〜2.5质量％ Al和不可避免的杂质，其中Si与Fe的含量比（Si / Fe）为0.75以下，溶质Mn含量为0.12〜0.20质量％，铝合金板的抗应力为225N / 在270℃下烘烤20秒后，mm2以上。
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