Invention Application
- Patent Title: METHOD FOR MAKING PATTERNED CONDUCTIVE ELEMENT
- Patent Title (中): 制作图形导电元件的方法
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Application No.: US13339703Application Date: 2011-12-29
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Publication No.: US20120312773A1Publication Date: 2012-12-13
- Inventor: JIA-SHYONG CHENG , PO-SHAN HUANG , PO-SHENG SHIH , CHUN-YI HU , CHIH-HAN CHAO , JEAH-SHENG WU
- Applicant: JIA-SHYONG CHENG , PO-SHAN HUANG , PO-SHENG SHIH , CHUN-YI HU , CHIH-HAN CHAO , JEAH-SHENG WU
- Applicant Address: TW Zhunan
- Assignee: SHIH HUA TECHNOLOGY LTD.
- Current Assignee: SHIH HUA TECHNOLOGY LTD.
- Current Assignee Address: TW Zhunan
- Priority: TW100120203 20110609
- Main IPC: H01B13/00
- IPC: H01B13/00 ; B32B37/14 ; B32B38/10

Abstract:
The present disclosure relates to a method for making pattern conductive element. The method includes steps. A substrate having a surface is provide. An adhesive layer is formed on the surface of the substrate. Part of the adhesive layer is solidified to form a solidified adhesive layer and a non-solidified adhesive layer. A carbon nanotube layer is applied on the adhesive layer. The non-solidified adhesive layer is solidified so that the carbon nanotube layer on the non-solidified adhesive layer forms a fixed carbon nanotube layer and the carbon nanotube layer on the solidified adhesive layer forms a non-fixed carbon nanotube layer. The non-fixed carbon nanotube layer is removed and the fixed carbon nanotube layer is remained to form a pattern carbon nanotube layer.
Public/Granted literature
- US08623224B2 Method for making patterned conductive element Public/Granted day:2014-01-07
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