Invention Application
- Patent Title: Slot Die Position Adjustment and Return to Baseline
- Patent Title (中): 插槽模具位置调整并返回基线
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Application No.: US13155349Application Date: 2011-06-07
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Publication No.: US20120313274A1Publication Date: 2012-12-13
- Inventor: Pentti K. Loukusa , Robert A. Yapel , Terence D. Neavin , Jennifer L. Trice , Kristopher K. Biegler , Paul C. Thomas , William J. Kopecky , Keith R. Bruesewitz , Robert B. Secor
- Applicant: Pentti K. Loukusa , Robert A. Yapel , Terence D. Neavin , Jennifer L. Trice , Kristopher K. Biegler , Paul C. Thomas , William J. Kopecky , Keith R. Bruesewitz , Robert B. Secor
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Main IPC: B29C47/92
- IPC: B29C47/92

Abstract:
A method of controlling a slot die comprises, while continuing to pass the extrudate through the fluid flow path and out the applicator slot, changing the position of the actuators with the controller to either increase the cross-directional thickness of the fluid flow path adjacent each of the actuators or substantially close the fluid flow path adjacent the actuators, and after changing the cross-directional thickness of the fluid flow path adjacent each of the actuators, while continuing to pass the extrudate through the fluid flow path and out the applicator slot, repositioning each of the actuators with the controller according to the set of discrete settings to resume operating the slot die with the actuators positioned according to the set of discrete settings.
Public/Granted literature
- US09044894B2 Slot die position adjustment and return to baseline Public/Granted day:2015-06-02
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