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公开(公告)号：US09044894B2
公开(公告)日：2015-06-02
申请号：US13155349
申请日：2011-06-07
申请人： Pentti K. Loukusa , Robert A. Yapel , Terence D. Neavin , Jennifer L. Trice , Kristopher K. Biegler , Paul C. Thomas , William J. Kopecky , Keith R. Bruesewitz , Robert B. Secor
发明人： Pentti K. Loukusa , Robert A. Yapel , Terence D. Neavin , Jennifer L. Trice , Kristopher K. Biegler , Paul C. Thomas , William J. Kopecky , Keith R. Bruesewitz , Robert B. Secor
CPC分类号： B29C47/92 , B05C5/0262 , B05C11/1005 , B29C47/0019 , B29C47/0021 , B29C47/0816 , B29C47/124 , B29C47/16 , B29C47/165 , B29C2947/92152 , B29C2947/92409 , B29C2947/92447 , B29C2947/926 , B29C2947/92647 , B29C2947/92904
摘要： A method of controlling a slot die comprises, while continuing to pass the extrudate through the fluid flow path and out the applicator slot, changing the position of the actuators with the controller to either increase the cross-directional thickness of the fluid flow path adjacent each of the actuators or substantially close the fluid flow path adjacent the actuators, and after changing the cross-directional thickness of the fluid flow path adjacent each of the actuators, while continuing to pass the extrudate through the fluid flow path and out the applicator slot, repositioning each of the actuators with the controller according to the set of discrete settings to resume operating the slot die with the actuators positioned according to the set of discrete settings.
摘要翻译： 一种控制狭槽模头的方法包括：在连续地将挤出物通过流体流动路径并从施加器槽中通过的同时，改变致动器与控制器的位置，以增加流体流动路径的横向厚度 或者基本上关闭与致动器相邻的流体流动路径，并且在改变与每个致动器相邻的流体流动路径的横向厚度的同时，继续使挤出物通过流体流动路径并且从施加器狭槽出来， 根据一组离散设置，使用控制器重新定位每个致动器，以根据一组离散设置使致动器定位，以恢复操作槽模。
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公开(公告)号：US08030591B2
公开(公告)日：2011-10-04
申请号：US11461156
申请日：2006-07-31
摘要： A cutting tool assembly using a machined tool operating in a plunge mode of electrical discharge machining to make microreplicated features in a work piece having a complex surface. The microreplicated features can be non-adjacent and can have any geometric configuration and micron-scaled dimensions, as determined by the microstructured features in the tool. The machined work piece can be used as a master tool in order to make microreplicated articles such as optical films, friction control films, plasma display panel molds, or micro-fasteners.
摘要翻译： 一种切割工具组件，其使用以放电加工的插入模式操作的加工工具，以使具有复杂表面的工件中的微复制特征。 微复制特征可以是不相邻的，并且可以具有由工具中的微结构特征确定的任何几何构型和微米级尺寸。 加工的工件可以用作主工具，以便制造诸如光学膜，摩擦控制膜，等离子体显示面板模具或微型紧固件的微复制品。
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3.发明授权公开(公告)号：US07510462B2
公开(公告)日：2009-03-31
申请号：US11454319
申请日：2006-06-16
申请人： William J. Bryan , Nelson D. Sewall , Jeffrey E. Clements , Greg E. Schrank , Jennifer L. Trice , Timothy L. Hoopman , Charles N. DeVore
发明人： William J. Bryan , Nelson D. Sewall , Jeffrey E. Clements , Greg E. Schrank , Jennifer L. Trice , Timothy L. Hoopman , Charles N. DeVore
IPC分类号： B24B1/00
CPC分类号： B23B29/26 , B23B5/00 , B23B2200/163 , B23B2200/167 , B29C59/007 , Y10T29/49995 , Y10T83/04 , Y10T409/303752
摘要： In one embodiment, a cutting tool assembly used for creating grooves in a microreplication tool is described. The cutting tool assembly includes a mounting structure and multiple diamonds mounted in the mounting structure. For example, first and second tool shanks having first and second diamond tips can be positioned in the mounting structure such that a cutting location of a diamond cutting tip of the first tool shank is a defined distance from a cutting location of a diamond cutting tip of the second tool shank. The defined distance may correspond to an integer number of pitch spacings, and may be accurate to within a tolerance of less than approximately 10 microns.
摘要翻译： 在一个实施例中，描述了用于在微复制工具中创建凹槽的切割工具组件。 切割工具组件包括安装结构和安装在安装结构中的多个钻石。 例如，具有第一和第二金刚石尖端的第一和第二工具柄可以定位在安装结构中，使得第一工具柄的金刚石切割尖端的切割位置距离金刚石切割尖端的切割位置的限定距离 第二个工具柄。 限定的距离可以对应于整数倍的间距间隔，并且可以精确到小于约10微米的公差内。
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4.发明授权In-situ short-circuit protection system and method for high-energy electrochemical cells 有权高能电化学电池原位短路保护系统及方法公开(公告)号：US06548206B1
公开(公告)日：2003-04-15
申请号：US09586218
申请日：2000-06-02
申请人： Michel Gauthier , Michael K. Domroese , Joseph A. Hoffman , David D. Lindeman , Joseph-Robert-Gaétan Noël , Vern E. Radewald , Jean Rouillard , Roger Rouillard , Toshimi Shiota , Jennifer L. Trice
发明人： Michel Gauthier , Michael K. Domroese , Joseph A. Hoffman , David D. Lindeman , Joseph-Robert-Gaétan Noël , Vern E. Radewald , Jean Rouillard , Roger Rouillard , Toshimi Shiota , Jennifer L. Trice
IPC分类号： H01M1050
CPC分类号： H02J7/0026 , H01M2/34 , H01M10/613 , H01M10/647 , H01M10/6554
摘要： An in-situ thermal management system for an energy storage device. The energy storage device includes a plurality of energy storage cells each being coupled in parallel to common positive and negative connections. Each of the energy storage cells, in accordance with the cell's technology, dimensions, and thermal/electrical properties, is configured to have a ratio of energy content-to-contact surface area such that thermal energy produced by a short-circuit in a particular cell is conducted to a cell adjacent the particular cell so as to prevent the temperature of the particular cell from exceeding a breakdown temperature. In one embodiment, a fuse is coupled in series with each of a number of energy storage cells. The fuses are activated by a current spike capacitively produced by a cell upon occurrence of a short-circuit in the cell, thereby electrically isolating the short-circuited cell from the common positive and negative connections.
摘要翻译： 一种用于能量存储装置的原位热管理系统。 能量存储装置包括多个能量存储单元，每个能量存储单元并联耦合到共同的正和负连接。 每个储能电池根据电池的技术，尺寸和热/电特性被配置为具有能量 - 接触表面积的比率，使得由特定的短路产生的热能 将电池传导到与特定电池相邻的电池，以防止特定电池的温度超过击穿温度。 在一个实施例中，熔丝与多个能量存储单元中的每一个串联耦合。 在电池中发生短路时，由电池电容性产生的电流尖峰激活保险丝，从而将短路电池与公共正极和负极连接电隔离。
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公开(公告)号：US6120930A
公开(公告)日：2000-09-19
申请号：US900924
申请日：1997-07-25
申请人： Roger Rouillard , Michael K. Domroese , Joseph A. Hoffman , David D. Lindeman , Joseph-Robert-Gaetan Noel , Vern E. Radewald , Michel Ranger , Anthony Sudano , Jennifer L. Trice , Thomas A. Turgeon
发明人： Roger Rouillard , Michael K. Domroese , Joseph A. Hoffman , David D. Lindeman , Joseph-Robert-Gaetan Noel , Vern E. Radewald , Michel Ranger , Anthony Sudano , Jennifer L. Trice , Thomas A. Turgeon
CPC分类号： H01M10/504 , H01M10/0413 , H01M10/0431 , H01M10/0436 , H01M10/0468 , H01M10/5004 , H01M10/5032 , H01M10/5051 , H01M10/5053 , H01M2/22 , H01M2/263 , H01M10/5057 , H01M2006/106 , H01M6/181
摘要： An improved electrochemical generator is disclosed. The electrochemical generator includes a thin-film electrochemical cell which is maintained in a state of compression through use of an internal or an external pressure apparatus. A thermal conductor, which is connected to at least one of the positive or negative contacts of the cell, conducts current into and out of the cell and also conducts thermal energy between the cell and thermally conductive, electrically resistive material disposed on a vessel wall adjacent the conductor. The thermally conductive, electrically resistive material may include an anodized coating or a thin sheet of a plastic, mineral-based material or conductive polymer material. The thermal conductor is fabricated to include a resilient portion which expands and contracts to maintain mechanical contact between the cell and the thermally conductive material in the presence of relative movement between the cell and the wall structure. The electrochemical generator may be disposed in a hermetically sealed housing.
摘要翻译： 公开了一种改进的电化学发生器。 电化学发生器包括通过使用内部或外部压力装置保持在压缩状态的薄膜电化学电池。 连接到电池的正极或负极触点中的至少一个的热导体将电流传导到电池中并流出电池，并且还在电池和导电的电阻材料之间传导热能，所述导电的电阻材料设置在相邻的容器壁上 导体。 导热电阻材料可以包括阳极氧化涂层或塑料，矿物基材料或导电聚合物材料的薄片。 热导体被制造成包括弹性部分，弹性部分在电池和壁结构之间的相对运动的存在下膨胀和收缩以保持电池和导热材料之间的机械接触。 电化学发生器可以设置在气密密封的壳体中。
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6.发明授权
公开(公告)号：US5179852A
公开(公告)日：1993-01-19
申请号：US788498
申请日：1991-11-06
IPC分类号： B23K20/00 , B21D31/06 , B23K35/30 , B23K101/20 , B23P5/00 , B23P9/04 , B24B39/00 , C21D1/18 , C21D7/06 , C21D9/22 , C22C38/00 , C22C38/32
CPC分类号： C21D1/18 , B21D31/06 , B23K35/3033 , B23P5/00 , B24B39/006 , C21D7/06 , Y10T29/479
摘要： An improved high-intensity rotary peening particle support of the type having a plurality of peening particles metallurgically secured to an exposed face thereof is presented, the support having a base composition consisting essentially of from about 0.08 to about 0.34 weight percent carbon, the balance iron, and a Ni-enriched layer which provides a hard, wear resistant surface. A method of producing such a support is also described, the method including cold forming a peening particle support base composition as described, stress relieving, brazing peening particles to an exposed face of the support, austenitizing, quenching, and tempering the support to form a support having a Ni-enriched layer which is harder than the base composition.
摘要翻译： 提供了具有冶金固定到其暴露表面上的多个喷丸颗粒类型的改进的高强度旋转喷丸颗粒载体，所述载体具有基本上由约0.08至约0.34重量百分比的碳组成的基础组合物，余量为 ，以及提供硬的耐磨表面的富镍层。 还描述了制备这种载体的方法，该方法包括将如上所述的喷丸颗粒载体基础组合物冷却成形，将应力消除，钎焊喷丸颗粒施加到载体的暴露面上，奥氏体化，淬火和回火以形成载体 支撑体具有比基体组合物更硬的Ni富集层。
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7.发明授权Aligned multi-diamond cutting tool assembly for creating microreplication tools 失效用于创建微复制工具的对齐多金刚石切割工具组件公开(公告)号：US07757591B2
公开(公告)日：2010-07-20
申请号：US11253496
申请日：2005-10-19
CPC分类号： B23B27/20 , B23B27/04 , B23B27/065 , B23B29/26 , B23B2226/31 , B23B2226/36 , B23B2240/08 , B23B2240/11 , B23B2240/21 , B23B2270/16 , B23C5/08 , B23C5/12 , B23C5/18 , B23C5/24 , Y10T82/10 , Y10T407/23
摘要： The disclosure is directed to a cutting tool assembly used for creating grooves in a microreplication tool. The cutting tool assembly includes a mounting structure and multiple diamonds aligned in the mounting structure to a tolerance of less than 10 microns. For example, first and second tool shanks having first and second diamond tips can be positioned in the mounting structure such that a cutting location of the first diamond tip is identical to a cutting location of the second diamond tip. However, the second diamond tip may be a defined distance further away from the mounting structure than the first diamond tip, or the second diamond tip may have a different shape than the first diamond tip. In this manner, the first diamond tip may cut a groove into a work piece and the second diamond tip may cut a sub-feature into the groove to create a multi-featured groove.
摘要翻译： 本发明涉及一种用于在微复制工具中产生凹槽的切割工具组件。 切割工具组件包括安装结构和在安装结构中对准的多个金刚石，其公差小于10微米。 例如，具有第一和第二金刚石尖端的第一和第二工具柄可以定位在安装结构中，使得第一金刚石尖端的切割位置与第二金刚石刀片的切割位置相同。 然而，第二金刚石尖端可以是比第一金刚石尖端更远离安装结构的限定距离，或者第二金刚石尖端可以具有与第一金刚石尖端不同的形状。 以这种方式，第一金刚石尖端可以将凹槽切割成工件，并且第二金刚石尖端可以将子特征切割到凹槽中以形成多功能凹槽。
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公开(公告)号：US20090277794A1
公开(公告)日：2009-11-12
申请号：US12117880
申请日：2008-05-09
IPC分类号： C25D1/20
摘要： A method includes placing a conductive mold in a first bath of electroforming solution, the solution including metal and having a selected temperature. A current is provided to the electroforming solution so that metal deposits onto the mold, thereby forming an electroformed element on the mold, the electroformed element and the mold being a composite assembly. The method further includes removing the composite assembly from the electroforming solution and transferring the composite assembly to a second bath having the same selected temperature. Thereafter, the electroformed element is separated from the mold while the composite assembly is in the second bath.
摘要翻译： 一种方法包括将导电模具放置在电铸溶液的第一浴中，溶液包括金属并具有选定的温度。 向电铸溶液提供电流，使得金属沉积到模具上，从而在模具上形成电铸元件，电铸元件和模具是复合组件。 该方法还包括从电铸溶液中除去复合组件并将复合组件转移到具有相同选定温度的第二槽中。 此后，电铸元件与模具分离，而复合组件处于第二槽中。
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公开(公告)号：US20080023446A1
公开(公告)日：2008-01-31
申请号：US11461156
申请日：2006-07-31
摘要： A cutting tool assembly using a machined tool operating in a plunge mode of electrical discharge machining to make microreplicated features in a work piece having a complex surface. The microreplicated features can be non-adjacent and can have any geometric configuration and micron-scaled dimensions, as determined by the microstructured features in the tool. The machined work piece can be used as a master tool in order to make microreplicated articles such as optical films, friction control films, plasma display panel molds, or micro-fasteners.
摘要翻译： 一种切割工具组件，其使用以放电加工的插入模式操作的加工工具，以使具有复杂表面的工件中的微复制特征。 微复制特征可以是不相邻的，并且可以具有由工具中的微结构特征确定的任何几何构型和微米级尺寸。 加工的工件可以用作主工具，以便制造诸如光学膜，摩擦控制膜，等离子体显示面板模具或微型紧固件的微复制品。
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10.发明授权Working liquids and methods for modifying structured wafers suited for semiconductor fabrication 有权用于修改适用于半导体制造的结构晶片的工作液体和方法公开(公告)号：US06238592B1
公开(公告)日：2001-05-29
申请号：US09266208
申请日：1999-03-10
IPC分类号： C09K1300
CPC分类号： C09K3/1463 , C09G1/02 , H01L21/3212
摘要： A family of working liquids useful in modifying exposed surfaces of wafers for semiconductor fabrication are provided along with methods of modifying exposed surfaces of wafers for semiconductor fabrication utilizing such a family of working liquids, and semiconductor wafers made according the foregoing process. The working liquid of the invention is a solution of initial components, the components comprising: an oxidizing agent; an ionic buffer; a passivating agent; a chelating agent selected from iminodiacetic acid and salts thereof; and water. The method of the invention comprises the steps of: a) providing a wafer comprising a first material having a surface etched to form a pattern and a second material deployed over the surface of the first material; b) contacting the second material of the wafer with abrasive in the presence of the working liquid; and c) relatively moving the wafer while the second material is in contact with the abrasive until an exposed surface of the wafer is planar and comprises at least one area of exposed first material and one area of exposed second material.
摘要翻译： 提供了可用于修改用于半导体制造的晶片的暴露表面的一系列工作液体，以及利用这样的工作液体族和根据前述方法制造的半导体晶片修改用于半导体制造的晶片的暴露表面的方法。 本发明的工作液是初始组分的溶液，其组分包括：氧化剂; 离子缓冲液 钝化剂; 选自亚氨基二乙酸及其盐的螯合剂; 和水。 本发明的方法包括以下步骤：a）提供包括第一材料的晶片，所述第一材料具有被蚀刻以形成图案的表面和在第一材料的表面上展开的第二材料; b）在工作液体的存在下使晶片的第二材料与研磨剂接触; 以及c）当所述第二材料与所述研磨剂接触时相对移动所述晶片，直到所述晶片的暴露表面是平面的并且包括暴露的第一材料和暴露的第二材料的一个区域的至少一个区域。
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