Invention Application
- Patent Title: APPARATUS OF MANUFACTURING SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES USING THE SAME
- Patent Title (中): 制造半导体封装的装置及使用其制造半导体封装的方法
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Application No.: US13495837Application Date: 2012-06-13
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Publication No.: US20120313332A1Publication Date: 2012-12-13
- Inventor: Chang-Seong Jeon , Sangwook Park , TeakHoon Lee , Ilyoung Han
- Applicant: Chang-Seong Jeon , Sangwook Park , TeakHoon Lee , Ilyoung Han
- Priority: KR10-2011-0056991 20110613
- Main IPC: H01L21/683
- IPC: H01L21/683
Abstract:
Apparatuses of manufacturing semiconductor packages are provided. An apparatus includes a chuck having a body, a porous plate disposed on the body, and a buffer pad disposed on the plate to provide a place on which a plurality of chips are loaded. The buffer pad has elasticity greater than the plate. The apparatus also includes a vacuum part supplying vacuum to the chuck so that the plurality of chips are sucked onto the buffer pad. Methods of manufacturing semiconductor packages using the apparatus are also provided.
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