Invention Application
US20120313621A1 PROBE BONDING METHOD HAVING IMPROVED CONTROL OF BONDING MATERIAL 有权
具有改进的粘结材料控制的探针结合方法

  • Patent Title: PROBE BONDING METHOD HAVING IMPROVED CONTROL OF BONDING MATERIAL
  • Patent Title (中): 具有改进的粘结材料控制的探针结合方法
  • Application No.: US13557879
    Application Date: 2012-07-25
  • Publication No.: US20120313621A1
    Publication Date: 2012-12-13
  • Inventor: January Kister
  • Applicant: January Kister
  • Applicant Address: US CA Carlsbad
  • Assignee: MICROPROBE, INC.
  • Current Assignee: MICROPROBE, INC.
  • Current Assignee Address: US CA Carlsbad
  • Main IPC: G01R1/067
  • IPC: G01R1/067
PROBE BONDING METHOD HAVING IMPROVED CONTROL OF BONDING MATERIAL
Abstract:
In assembly of probe arrays for electrical test, a problem can arise where a bonding agent undesirably wicks between probes. According to embodiments of the invention, this wicking problem is alleviated by disposing an anti-wicking agent on a surface of the probe assembly such that wicking of the bonding agent along the probes toward the probe tips is hindered. The anti-wicking agent can be a solid powder, a liquid, or a gel. Once probe assembly fabrication is complete, the anti-wicking agent is removed. In preferred embodiments, a template plate is employed to hold the probe tips in proper position during fabrication. In this manner, undesirable bending of probes caused by introduction or removal of the anti-wicking agent can be reduced or eliminated.
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