Invention Application
US20120313621A1 PROBE BONDING METHOD HAVING IMPROVED CONTROL OF BONDING MATERIAL
有权
具有改进的粘结材料控制的探针结合方法
- Patent Title: PROBE BONDING METHOD HAVING IMPROVED CONTROL OF BONDING MATERIAL
- Patent Title (中): 具有改进的粘结材料控制的探针结合方法
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Application No.: US13557879Application Date: 2012-07-25
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Publication No.: US20120313621A1Publication Date: 2012-12-13
- Inventor: January Kister
- Applicant: January Kister
- Applicant Address: US CA Carlsbad
- Assignee: MICROPROBE, INC.
- Current Assignee: MICROPROBE, INC.
- Current Assignee Address: US CA Carlsbad
- Main IPC: G01R1/067
- IPC: G01R1/067

Abstract:
In assembly of probe arrays for electrical test, a problem can arise where a bonding agent undesirably wicks between probes. According to embodiments of the invention, this wicking problem is alleviated by disposing an anti-wicking agent on a surface of the probe assembly such that wicking of the bonding agent along the probes toward the probe tips is hindered. The anti-wicking agent can be a solid powder, a liquid, or a gel. Once probe assembly fabrication is complete, the anti-wicking agent is removed. In preferred embodiments, a template plate is employed to hold the probe tips in proper position during fabrication. In this manner, undesirable bending of probes caused by introduction or removal of the anti-wicking agent can be reduced or eliminated.
Public/Granted literature
- US09250266B2 Probe bonding method having improved control of bonding material Public/Granted day:2016-02-02
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