Invention Application
- Patent Title: CAPACITOR ARRAY SUBSTRATE
- Patent Title (中): 电容阵列基板
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Application No.: US13459259Application Date: 2012-04-30
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Publication No.: US20120314392A1Publication Date: 2012-12-13
- Inventor: Wing-Kai Tang , Ching-Chun Lin , Hao-Jan Huang , Yu-Tsung Lu , Jiun-Jie Tsai , Tsen-Wei Chang
- Applicant: Wing-Kai Tang , Ching-Chun Lin , Hao-Jan Huang , Yu-Tsung Lu , Jiun-Jie Tsai , Tsen-Wei Chang
- Applicant Address: TW Hsinchu
- Assignee: NOVATEK MICROELECTRONICS CORP.
- Current Assignee: NOVATEK MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Priority: TW100119880 20110607
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
A capacitor array substrate includes a substrate, first traces, second traces, capacitors, connecting lines, and signal lines. The substrate has a first, a second, and a third side. The first side is connected with the second and the third side. The first traces are disposed on the substrate in parallel and are not vertical or parallel to the first side. The second traces are disposed on the substrate in parallel. The capacitors are disposed on the substrate at intersections of the first and the second traces and are connected to the first and the second traces. The connecting lines are disposed on the second and the third side of the substrate. Each connecting line is connected to a first and a second trace. The signal lines are disposed on the substrate. Each signal line is connected to a first or a second trace and transmits signals from the first side.
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