Invention Application
- Patent Title: SINGLE FPC BOARD FOR CONNECTING MULTIPLE MODULES AND TOUCH SENSITIVE DISPLAY MODULE USING THE SAME
- Patent Title (中): 用于连接多个模块和触摸感应显示模块的单个FPC板
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Application No.: US13438636Application Date: 2012-04-03
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Publication No.: US20120319967A1Publication Date: 2012-12-20
- Inventor: Jiun-Jie Tsai , Ching-Chun Lin , Tsen-Wei Chang , Yu-Tsung Lu , Tzu-Jen Lo , Hao-Jan Huang , Wing-Kai Tang
- Applicant: Jiun-Jie Tsai , Ching-Chun Lin , Tsen-Wei Chang , Yu-Tsung Lu , Tzu-Jen Lo , Hao-Jan Huang , Wing-Kai Tang
- Applicant Address: TW Hsinchu
- Assignee: NOVATEK MICROELECTRONICS CORP.
- Current Assignee: NOVATEK MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Priority: TW100129439 20110817
- Main IPC: G06F3/041
- IPC: G06F3/041 ; H05K1/02
Abstract:
A single flexible printed circuit (FPC) board for connecting multiple modules including a thin film is provided. The thin film has a first module connecting portion, a second module connecting portion and a third module connecting portion. The first module connecting portion is located on a first side of the thin film. The second module connecting portion and the third module connecting portion are located on a second side of the thin film. The first side is opposite to the second side. At least one first line is disposed between the first module connecting portion and the second module connecting portion. At least one second line is disposed between the first module connecting portion and the third module connecting portion.
Public/Granted literature
- US09084368B2 Single FPC board for connecting multiple modules and touch sensitive display module using the same Public/Granted day:2015-07-14
Information query
