Invention Application
- Patent Title: THREE-DIMENSIONAL WORKPIECE
- Patent Title (中): 三维工作
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Application No.: US13517559Application Date: 2012-06-13
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Publication No.: US20120321840A1Publication Date: 2012-12-20
- Inventor: Jung-Chin Wu , Po-An Lin , Kuo-Nan Ling , Han-Ching Huang , Wan-Li Chuang
- Applicant: Jung-Chin Wu , Po-An Lin , Kuo-Nan Ling , Han-Ching Huang , Wan-Li Chuang
- Applicant Address: TW Taipei City
- Assignee: COMPAL ELECTRONICS, INC.
- Current Assignee: COMPAL ELECTRONICS, INC.
- Current Assignee Address: TW Taipei City
- Main IPC: B32B3/24
- IPC: B32B3/24 ; B32B3/12

Abstract:
A three-dimensional workpiece including a first ductile plate, a second ductile plate and a core layer is provided. The core layer is located between the first ductile plate and the second ductile plate. The first ductile plate, the second ductile plate and the core layer are bound together and have a three-dimensional shape. The first ductile plate has a flat area and a curved area. The core layer has a core flat area and a core curved area. The core flat area is superposed with the plate flat area and the core curved area is superposed with the plate curved area.
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