发明申请
- 专利标题： METHOD FOR CONTROLLED LAYER TRANSFER
- 专利标题（中）： 控制层转移方法
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申请号： US13159893申请日： 2011-06-14
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公开(公告)号： US20120322227A1公开(公告)日： 2012-12-20
- 发明人: Stephen W. Bedell , Keith E. Fogel , Paul A. Lauro , Devendra K. Sadana
- 申请人： Stephen W. Bedell , Keith E. Fogel , Paul A. Lauro , Devendra K. Sadana
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/30
- IPC分类号： H01L21/30
摘要：
A method of controlled layer transfer is provided. The method includes providing a stressor layer to a base substrate. The stressor layer has a stressor layer portion located atop an upper surface of the base substrate and a self-pinning stressor layer portion located adjacent each sidewall edge of the base substrate. A spalling inhibitor is then applied atop the stressor layer portion of the base substrate, and thereafter the self-pinning stressor layer portion of the stressor layer is decoupled from the stressor layer portion. A portion of the base substrate that is located beneath the stressor layer portion is then spalled from the original base substrate. The spalling includes displacing the spalling inhibitor from atop the stressor layer portion. After spalling, the stressor layer portion is removed from atop a spalled portion of the base substrate.
公开/授权文献
- US08709914B2 Method for controlled layer transfer 公开/授权日：2014-04-29
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