发明申请
- 专利标题： METHODS AND LOADPORT FOR PURGING A SUBSTRATE CARRIER
- 专利标题（中）： 用于采集基板载体的方法和装载
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申请号： US13605927申请日： 2012-09-06
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公开(公告)号： US20120325328A1公开(公告)日： 2012-12-27
- 发明人: Vinay K. Shah , Eric Englhardt , Jeffrey C. Hudgens , Martin Elliott
- 申请人： Vinay K. Shah , Eric Englhardt , Jeffrey C. Hudgens , Martin Elliott
- 申请人地址： US CA Santa Clara
- 专利权人： APPLIED MATERIALS, INC.
- 当前专利权人： APPLIED MATERIALS, INC.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： F17D3/00
- IPC分类号： F17D3/00
摘要：
In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed. Numerous other aspects are provided.
公开/授权文献
- US08689812B2 Methods and loadport for purging a substrate carrier 公开/授权日：2014-04-08
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