Invention Application
- Patent Title: BONDING STRUCTURE OF METAL MEMBER AND COMPOSITE-MATERIAL MEMBER
- Patent Title (中): 金属构件和复合材料构件的结合结构
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Application No.: US13460749Application Date: 2012-04-30
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Publication No.: US20120325832A1Publication Date: 2012-12-27
- Inventor: Shinsuke Takeuchi , Eiichi Sato
- Applicant: Shinsuke Takeuchi , Eiichi Sato
- Priority: JP2009-249822 20091030
- Main IPC: B65D6/40
- IPC: B65D6/40 ; B32B1/00 ; B32B3/30
Abstract:
Provided is a bonding structure of a metal member and a composite-material member which comprises a composite-material member and a metal member adhesively bonded to the composite-material member through an adhesive bonding surface therebetween. The metal member has a slit extending along the adhesive bonding surface to form a thin-walled portion between the adhesive bonding surface and the slit.
Public/Granted literature
- US08763846B2 Bonding structure of metal member and composite-material member Public/Granted day:2014-07-01
Information query
