Invention Application
- Patent Title: LAMINATED FILM AND USE THEREOF
- Patent Title (中): 层压膜及其使用
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Application No.: US13530068Application Date: 2012-06-21
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Publication No.: US20120326280A1Publication Date: 2012-12-27
- Inventor: Takashi Oda , Naohide Takamoto , Hiroyuki Senzai
- Applicant: Takashi Oda , Naohide Takamoto , Hiroyuki Senzai
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2011-138438 20110622
- Main IPC: H01L23/544
- IPC: H01L23/544 ; B32B7/12 ; C09J7/02 ; H01L21/78
Abstract:
Provided is a laminated film wherein the space between semiconductor elements that are three-dimensionally mounted can be filled easily and securely. The laminated film of the present invention is a laminated film for filling the space between semiconductor elements that are electrically connected through a member or connection, the film including a dicing sheet in which a pressure-sensitive adhesive layer is laminated on a base material and a curable film that is laminated on the pressure-sensitive adhesive layer, wherein the curable film has a lowest melt viscosity at 50 to 200° C. of 1×102 Pa·s or more and 1×104 Pa·s or less.
Public/Granted literature
- US09202795B2 Laminated film and use thereof Public/Granted day:2015-12-01
Information query
IPC分类:
