公开(公告)号：US20120329250A1

公开(公告)日：2012-12-27

申请号：US13530037

申请日：2012-06-21

Applicant: Takashi Oda ,  Naohide Takamoto ,  Hiroyuki Senzai

Inventor： Takashi Oda ,  Naohide Takamoto ,  Hiroyuki Senzai

IPC: H01L21/78

CPC classification number: H01L24/27 ,  H01L23/3114 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/81193 ,  H01L2224/8191 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/01029 ,  H01L2924/15787 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Provided is a method of manufacturing a semiconductor device wherein the space between semiconductor elements that are three-dimensionally mounted can be filled easily and securely. The method of manufacturing a semiconductor device of the present invention includes preparing a semiconductor wafer with a plurality of members for connection formed on both first and second surfaces; preparing a laminated film including a dicing sheet with a pressure-sensitive adhesive layer laminated on a base material, and a curable film that is laminated on the pressure-sensitive adhesive layer and has a thickness equivalent to or more than the height of the member for connection on the first surface; pasting the curable film of the laminated film to the semiconductor wafer while facing the curable film to the first surface so that the members for connection are not exposed to the pressure-sensitive adhesive layer; and dicing the semiconductor wafer to form a semiconductor element.

Abstract translation: 提供一种制造半导体器件的方法，其中可以容易且可靠地填充三维安装的半导体元件之间的空间。 本发明的半导体器件的制造方法包括：在第一和第二表面上制备具有多个用于连接的构件的半导体晶片; 制备包括层压在基材上的压敏粘合剂层的切割片的层压膜和层压在压敏粘合剂层上的厚度等于或大于该部件的高度的固化膜 第一面上的连接; 将所述层叠膜的固化膜粘贴到所述半导体晶片，同时将所述固化膜面向所述第一表面，使得所述连接构件不暴露于所述压敏粘合剂层; 并切割半导体晶片以形成半导体元件。

公开(公告)号：US09202795B2

公开(公告)日：2015-12-01

申请号：US13530068

申请日：2012-06-21

Applicant: Takashi Oda ,  Naohide Takamoto ,  Hiroyuki Senzai

Inventor： Takashi Oda ,  Naohide Takamoto ,  Hiroyuki Senzai

IPC: H01L23/544 ,  H01L23/00 ,  H01L25/065 ,  C09J7/02 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L24/27 ,  C09J7/22 ,  C09J7/30 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L23/29 ,  H01L23/3114 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/81193 ,  H01L2224/8191 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/01029 ,  H01L2924/15787 ,  Y10T428/2826 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Provided is a laminated film wherein the space between semiconductor elements that are three-dimensionally mounted can be filled easily and securely. The laminated film of the present invention is a laminated film for filling the space between semiconductor elements that are electrically connected through a member or connection, the film including a dicing sheet in which a pressure-sensitive adhesive layer is laminated on a base material and a curable film that is laminated on the pressure-sensitive adhesive layer, wherein the curable film has a lowest melt viscosity at 50 to 200° C. of 1×102 Pa·s or more and 1×104 Pa·s or less.

Abstract translation: 提供一种层叠膜，其中可以容易且可靠地填充三维安装的半导体元件之间的空间。 本发明的层压膜是用于填充通过构件或连接电连接的半导体元件之间的空间的层压膜，该膜包括其中压敏粘合剂层层压在基材上的切割片和 层压在粘合剂层上的固化膜，其中固化膜在50〜200℃下的熔融粘度最低为1×102Pa·s以上且1×104Pa·s以下。

公开(公告)号：US08420510B2

公开(公告)日：2013-04-16

申请号：US13530037

申请日：2012-06-21

Applicant: Takashi Oda ,  Naohide Takamoto ,  Hiroyuki Senzai

Inventor： Takashi Oda ,  Naohide Takamoto ,  Hiroyuki Senzai

IPC: H01L21/00

CPC classification number: H01L24/27 ,  H01L23/3114 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/81193 ,  H01L2224/8191 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/01029 ,  H01L2924/15787 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Provided is a method of manufacturing a semiconductor device wherein the space between semiconductor elements that are three-dimensionally mounted can be filled easily and securely. The method of manufacturing a semiconductor device of the present invention includes preparing a semiconductor wafer with a plurality of members for connection formed on both first and second surfaces; preparing a laminated film including a dicing sheet with a pressure-sensitive adhesive layer laminated on a base material, and a curable film that is laminated on the pressure-sensitive adhesive layer and has a thickness equivalent to or more than the height of the member for connection on the first surface; pasting the curable film of the laminated film to the semiconductor wafer while facing the curable film to the first surface so that the members for connection are not exposed to the pressure-sensitive adhesive layer; and dicing the semiconductor wafer to form a semiconductor element.

Abstract translation: 提供一种制造半导体器件的方法，其中可以容易且可靠地填充三维安装的半导体元件之间的空间。 本发明的半导体器件的制造方法包括：在第一和第二表面上制备具有多个用于连接的构件的半导体晶片; 制备包括层压在基材上的压敏粘合剂层的切割片的层压膜和层压在压敏粘合剂层上的厚度等于或大于该部件的高度的固化膜 第一面上的连接; 将所述层叠膜的固化膜粘贴到所述半导体晶片，同时将所述固化膜面向所述第一表面，使得所述连接构件不暴露于所述压敏粘合剂层; 并切割半导体晶片以形成半导体元件。

公开(公告)号：US20120326280A1

公开(公告)日：2012-12-27

申请号：US13530068

申请日：2012-06-21

Applicant: Takashi Oda ,  Naohide Takamoto ,  Hiroyuki Senzai

Inventor： Takashi Oda ,  Naohide Takamoto ,  Hiroyuki Senzai

IPC: H01L23/544 ,  B32B7/12 ,  C09J7/02 ,  H01L21/78

CPC classification number: H01L24/27 ,  C09J7/22 ,  C09J7/30 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L23/29 ,  H01L23/3114 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/81193 ,  H01L2224/8191 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/01029 ,  H01L2924/15787 ,  Y10T428/2826 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Provided is a laminated film wherein the space between semiconductor elements that are three-dimensionally mounted can be filled easily and securely. The laminated film of the present invention is a laminated film for filling the space between semiconductor elements that are electrically connected through a member or connection, the film including a dicing sheet in which a pressure-sensitive adhesive layer is laminated on a base material and a curable film that is laminated on the pressure-sensitive adhesive layer, wherein the curable film has a lowest melt viscosity at 50 to 200° C. of 1×102 Pa·s or more and 1×104 Pa·s or less.

Abstract translation: 提供一种层叠膜，其中可以容易且可靠地填充三维安装的半导体元件之间的空间。 本发明的层压膜是用于填充通过构件或连接电连接的半导体元件之间的空间的层压膜，该膜包括其中压敏粘合剂层层压在基材上的切割片和 层压在粘合剂层上的固化膜，其中固化膜在50〜200℃下的熔融粘度最低为1×102Pa·s以上且1×104Pa·s以下。

公开(公告)号：US20120205820A1

公开(公告)日：2012-08-16

申请号：US13364592

申请日：2012-02-02

Applicant: Takashi Oda ,  Kosuke Morita ,  Hiroyuki Senzai

Inventor： Takashi Oda ,  Kosuke Morita ,  Hiroyuki Senzai

IPC: H01L23/522 ,  B32B7/02 ,  B32B27/38 ,  H01L21/56

CPC classification number: H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L2224/29082 ,  H01L2224/73104 ,  H01L2224/83191 ,  Y10T428/24942 ,  Y10T428/2495

Abstract: Provided are an encapsulating resin sheet having improved a connection reliability by improving a connection failure, and by suppressing intrusion of an inorganic filler between terminals of the semiconductor element and the interconnection circuit substrate, a semiconductor device using the same, and a fabricating method for the semiconductor device. The encapsulating resin sheet is an epoxy resin composition sheet having a two-layer structure of an inorganic filler containing layer and an inorganic filler non-containing layer, in which a melt viscosity of the inorganic filler containing layer is 1.0×102 to 2.0×104 Pa·s, a melt viscosity of the inorganic filler non-containing layer is 1.0×103 to 2.0×105 Pa·s, a viscosity difference between both layers is 1.5×104 Pa·s or more; and a thickness of the inorganic filler non-containing layer is ⅓ to ⅘ of a height of the connecting electrode portion formed in the semiconductor element.

Abstract translation: 提供一种封装树脂片，其通过改善连接故障而提高连接可靠性，并且通过抑制半导体元件和互连电路基板的端子之间的无机填料的侵入，使用该封装树脂片的半导体器件及其制造方法 半导体器件。 封装树脂片是具有无机填料含有层和无机填料不含层的两层结构的无机填料含有层的熔融粘度为1.0×10 2〜2.0×10 4的环氧树脂组合物片 Pa·s时，无机填料无含水层的熔融粘度为1.0×10 3〜2.0×10 5 Pa·s，两层之间的粘度差为1.5×10 4 Pa·s以上; 无机填料不含有层的厚度为半导体元件中形成的连接电极部的高度的1/3〜。。