Invention Application
- Patent Title: STACKED SEMICONDUCTOR DEVICE
- Patent Title (中): 堆叠半导体器件
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Application No.: US13534792Application Date: 2012-06-27
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Publication No.: US20120326307A1Publication Date: 2012-12-27
- Inventor: Se-young JEONG , Sang-sick PARK , Tae-gyeong CHUNG , Tae-je CHO
- Applicant: Se-young JEONG , Sang-sick PARK , Tae-gyeong CHUNG , Tae-je CHO
- Priority: KR10-2011-0062479 20110627
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L25/07
Abstract:
A stacked semiconductor device including a plurality of semiconductor chips stacked vertically, a plurality of scribe lane elements each forming a step with a semiconductor chip of the plurality of semiconductor chips and respectively formed on a side surface of each of the plurality of semiconductor chips, a redistribution element respectively formed on each of the plurality of semiconductor chips and the scribe lane elements, and a signal connection member formed on the side surface of each of the plurality of semiconductor chips and electrically connecting the redistribution elements.
Information query
IPC分类:
