Invention Application
- Patent Title: TEMPERATURE MEASURING APPARATUS, SUBSTRATE PROCESSING APPARATUS AND TEMPERATURE MEASURING METHOD
- Patent Title (中): 温度测量装置，基板加工装置和温度测量方法
-
Application No.: US13529368Application Date: 2012-06-21
-
Publication No.: US20120327393A1Publication Date: 2012-12-27
- Inventor: Tatsuo MATSUDO , Kenji NAGAI
- Applicant: Tatsuo MATSUDO , Kenji NAGAI
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Priority: JP2011-140890 20110624
- Main IPC: G01J5/48
- IPC: G01J5/48
Abstract:
The temperature measuring apparatus includes a data input portion, a peak interval calculation portion, an optical path length calculation portion, and a temperature calculation portion. The data input portion inputs a spectrum of interference light that is obtained when measuring light is irradiated onto a surface of the object and the measuring light reflected from the surface and the measuring light reflected from a rear surface interfere with each other. The peak interval calculation portion calculates a peak interval of the input spectrum. The optical path length calculation portion calculates an optical path length based on the peak interval. The temperature calculation portion calculates the temperature of the object based on the optical path length.
Information query
