Invention Application
- Patent Title: Joint Structures Having Organic Preservative Films
- Patent Title (中): 具有有机防腐膜的接头结构
-
Application No.: US13535766Application Date: 2012-06-28
-
Publication No.: US20130000978A1Publication Date: 2013-01-03
- Inventor: Ju-Il Choi , Jeong-Gi Jin , Ui-Hyoung Lee , Hyung-Seok Kim , Jeong-Woo Park
- Applicant: Ju-Il Choi , Jeong-Gi Jin , Ui-Hyoung Lee , Hyung-Seok Kim , Jeong-Woo Park
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Priority: KR10-2011-0063795 20110629
- Main IPC: H01R4/02
- IPC: H01R4/02
Abstract:
The inventive concept provides methods for inhibiting the formation of one or more oxides on metal bumps during the formation of solder joint structures and solder joint structures including one or more preservative films. In some embodiments, the solder joint structure includes a metal bump having a preservative film disposed on the surface thereof.
Public/Granted literature
- US09082680B2 Joint structures having organic preservative films Public/Granted day:2015-07-14
Information query
