发明申请
US20130001803A1 METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATTACHING A CHIP TO A CHIP CARRIER, A CHIP-PACKAGING MODULE AND A PACKAGING MODULE
有权
用于将金属表面连接到载体的方法，用于将芯片连接到芯片载体的方法，芯片包装模块和包装模块
- 专利标题： METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATTACHING A CHIP TO A CHIP CARRIER, A CHIP-PACKAGING MODULE AND A PACKAGING MODULE
- 专利标题（中）： 用于将金属表面连接到载体的方法，用于将芯片连接到芯片载体的方法，芯片包装模块和包装模块
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申请号： US13172989申请日： 2011-06-30
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公开(公告)号： US20130001803A1公开(公告)日： 2013-01-03
- 发明人: Manfred Mengel , Joachim Mahler , Khalil Hosseini , Horst Theuss
- 申请人： Manfred Mengel , Joachim Mahler , Khalil Hosseini , Horst Theuss
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; B23P25/00 ; B32B3/26 ; H01L21/50
摘要：
A method for attaching a metal surface to a carrier is provided, the method including: depositing a porous layer over at least one of a metal surface and a side of a carrier; and attaching the at least one of a metal surface and a side of a carrier to the porous layer by bringing a material into pores of the porous layer, resulting in the material forming an interconnection between the metal surface and the carrier.
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