发明申请
US20130004708A1 MOLDING APPARATUS, METHOD OF FORMING MOLDED PRODUCT, AND MOLDED PRODUCT
审中-公开
成型设备，成型产品的方法和模制产品
- 专利标题： MOLDING APPARATUS, METHOD OF FORMING MOLDED PRODUCT, AND MOLDED PRODUCT
- 专利标题（中）： 成型设备，成型产品的方法和模制产品
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申请号： US13530542申请日： 2012-06-22
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公开(公告)号： US20130004708A1公开(公告)日： 2013-01-03
- 发明人: Shun Kayama , Yukiko Shimizu , Atsuhide Hanyu , Susumu Hoshino , Keisuke Kawamura
- 申请人： Shun Kayama , Yukiko Shimizu , Atsuhide Hanyu , Susumu Hoshino , Keisuke Kawamura
- 申请人地址： JP Tokyo
- 专利权人： SONY CORPORATION
- 当前专利权人： SONY CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2011-144598 20110629; JP2011-207914 20110922; JP2011-273682 20111214
- 主分类号： B29C45/26
- IPC分类号： B29C45/26 ; B32B3/24 ; B29C45/00 ; B29C45/03 ; B29C45/72
摘要：
A molding apparatus includes a cavity mold, a core mold, a core pin, and a cavity pin. After molten resin has been filled in a cavity, at least one of the core pin and the cavity pin is moved to be pressed onto the molten resin so that a part of the molten resin is compressed before the molten resin is cured, and a molded hole is formed by cutting off the compressed part of the molten resin by moving the core pin and the cavity pin.
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