发明申请
- 专利标题： POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- 专利标题（中）： 功率模块封装及其制造方法
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申请号： US13280866申请日： 2011-10-25
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公开(公告)号： US20130010425A1公开(公告)日： 2013-01-10
- 发明人: Jin Suk SON , Kwang Soo KIM , Young Ki LEE , Sun Woo YUN , Sung Keun PARK
- 申请人： Jin Suk SON , Kwang Soo KIM , Young Ki LEE , Sun Woo YUN , Sung Keun PARK
- 申请人地址： KR Gyunggi-do
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Gyunggi-do
- 优先权： KR10-2011-0068003 20110708
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; B32B37/14
摘要：
Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer.
公开/授权文献
- US08792239B2 Power module package and method for manufacturing the same 公开/授权日：2014-07-29