发明申请
US20130010429A1 METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND POWER MODULE
有权
用于生产用于散热的功率模块的基板，具有散热功率模块的基板和功率模块
- 专利标题： METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND POWER MODULE
- 专利标题（中）： 用于生产用于散热的功率模块的基板，具有散热功率模块的基板和功率模块
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申请号： US13394923申请日： 2010-09-07
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公开(公告)号： US20130010429A1公开(公告)日： 2013-01-10
- 发明人: Hiroshi Tonomura , Yoshiyuki Nagatomo , Yoshirou Kuromitsu
- 申请人： Hiroshi Tonomura , Yoshiyuki Nagatomo , Yoshirou Kuromitsu
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Materials Corporation
- 当前专利权人： Mitsubishi Materials Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2009-208438 20090909; JP2009-208439 20090909; JP2009-252114 20091102; JP2009-252115 20091102
- 国际申请： PCT/JP2010/065316 WO 20100907
- 主分类号： B23K31/02
- IPC分类号： B23K31/02 ; B23K1/19 ; H05K7/20
摘要：
A method for producing a substrate for a power module with a heat sink includes a heat sink bonding step for bonding a heat sink to the surface of a second metal plate. The heat sink bonding step includes: a Cu layer forming step for forming a Cu layer on at least one of the surface of the second metal plate and a bonding surface of the heat sink; a heat sink laminating step for laminating the second metal plate and the heat sink via the Cu layer; a heat sink heating step for pressing in the lamination direction and heating the second metal plate and the heat sink, to diffuse Cu in the Cu layer into the second metal plate and the heat sink; and a molten metal solidifying step for solidifying the molten metal formed with Cu diffusion, to bond the second metal plate and the heat sink.
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