Disclosed herein is a thermoelectric module. The thermoelectric module includes: an upper substrate and a lower substrate each having a plurality of grooves formed on one surface thereof; a plurality of heat radiation pads embedded in the plurality of grooves; a plurality of electrodes formed on surfaces of the plurality of heat radiation pads and corresponding to the plurality of heat radiation pads one by one; and thermoelectric elements including p-type elements and n-type elements and electrically connected to the plurality of electrodes. According to the present invention, the heat radiation pads are embedded in the respective grooves formed on the upper substrate and the lower substrate, thereby maximizing heat transfer efficiency, and functioning as an insulator for preventing an electric short between the substrates and the electrodes.