发明申请
- 专利标题: MEMS Structure And Method Of Forming Same
- 专利标题(中): MEMS结构及其形成方法
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申请号: US13219927申请日: 2011-08-29
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公开(公告)号: US20130015743A1公开(公告)日: 2013-01-17
- 发明人: Yi Heng Tsai , Chia-Hua Chu , Kuei-Sung Chang
- 申请人: Yi Heng Tsai , Chia-Hua Chu , Kuei-Sung Chang
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: H02N1/00
- IPC分类号: H02N1/00 ; H01S4/00
摘要:
A microelectromechanical system (MEMS) device that reduces or eliminates stiction includes a substrate and a movable element at least partially suspended above the substrate and having at least one degree of freedom. A protrusion extends from the substrate and is configured to contact the movable element when the moving element moves in the at least one degree of freedom. The protrusion comprises a surface having a low surface energy relative a silicon oxide surface. The protrusion may be coupled to a voltage potential node to avoid or counteract electrostatic forces.
公开/授权文献
- US09065358B2 MEMS structure and method of forming same 公开/授权日:2015-06-23
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