发明申请
- 专利标题: LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
- 专利标题(中): 激光加工方法和激光加工设备
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申请号: US13596781申请日: 2012-08-28
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公开(公告)号: US20130017670A1公开(公告)日: 2013-01-17
- 发明人: Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
- 申请人: Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
- 申请人地址: JP Hamamatsu-shi
- 专利权人: Hamamatsu Photonics K.K.
- 当前专利权人: Hamamatsu Photonics K.K.
- 当前专利权人地址: JP Hamamatsu-shi
- 优先权: JP2000-278306 20000913
- 主分类号: B23K26/00
- IPC分类号: B23K26/00 ; B23K26/06 ; H01L21/268 ; B23K26/08
摘要:
A laser processing method comprising a step of irradiating an object to be processed with laser light elliptically polarized with an ellipticity of other than 1 such that a light-converging point of the laser light is located within the object along the major axis of an ellipse indicative of the elliptical polarization of laser light, along a line which the object is intended to be cut, to form a modified region caused by multiphoton absorption within the object, along the line which the object is intended to be cut.
公开/授权文献
- US08716110B2 Laser processing method and laser processing apparatus 公开/授权日:2014-05-06
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