- 专利标题: SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
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申请号: US13546163申请日: 2012-07-11
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公开(公告)号: US20130020720A1公开(公告)日: 2013-01-24
- 发明人: Young Lyong Kim , Taehoon Kim , Jongho Lee , Chul-Yong Jang
- 申请人: Young Lyong Kim , Taehoon Kim , Jongho Lee , Chul-Yong Jang
- 优先权: KR10-2011-0071016 20110718; KR10-2012-0029739 20120323
- 主分类号: H01L25/07
- IPC分类号: H01L25/07
摘要:
A semiconductor package may include a substrate including a substrate connection terminal, at least one semiconductor chip stacked on the substrate and having a chip connection terminal, a first insulating layer covering at least portions of the substrate and the at least one semiconductor chip, and/or an interconnection penetrating the first insulating layer to connect the substrate connection terminal to the chip connection terminal. A semiconductor package may include stacked semiconductor chips, edge portions of the semiconductor chips constituting a stepped structure, and each of the semiconductor chips including a chip connection terminal; at least one insulating layer covering at least the edge portions of the semiconductor chips; and/or an interconnection penetrating the at least one insulating layer to connect to the chip connection terminal of each of the semiconductor chips.
公开/授权文献
- US08970046B2 Semiconductor packages and methods of forming the same 公开/授权日:2015-03-03
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