发明申请
- 专利标题： MOLDING DIE SET AND RESIN MOLDING APPARATUS HAVING THE SAME
- 专利标题（中）： 成型模具和树脂成型设备
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申请号： US13361782申请日： 2012-01-30
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公开(公告)号： US20130028998A1公开(公告)日： 2013-01-31
- 发明人: Masanori Maekawa , Tomokazu Takahashi
- 申请人： Masanori Maekawa , Tomokazu Takahashi
- 优先权： JP2011-166251 20110729
- 主分类号： B29C45/02
- IPC分类号： B29C45/02
摘要：
The molding die set includes: a first molding die having a first molding chase, a cavity piece, supported by the first molding chase, movably supported by the first molding chase and enclosing the cavity piece; a second molding die having a second molding chase, a work supporting section biased and supported by the second molding chase and on which a work will be mounted, and a center insert located adjacent to the work supporting section; and a pot being provided to one of the first molding die and the second molding die, the pot feeding resin for molding the work. The second molding die has a thickness adjusting mechanism, which makes the work supporting section absorb thickness variation of the work and brings the work into contact with the movable clamper when the work is clamped with the movable clamper of the first molding die.
公开/授权文献
- US08727757B2 Molding die set and resin molding apparatus having the same 公开/授权日：2014-05-20
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