Invention Application
- Patent Title: LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 发光二极管封装及其制造方法
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Application No.: US13564330Application Date: 2012-08-01
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Publication No.: US20130032843A1Publication Date: 2013-02-07
- Inventor: Cheol Jun YOO , Young Hee Song
- Applicant: Cheol Jun YOO , Young Hee Song
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Priority: KR10-2011-0076612 20110801
- Main IPC: H01L33/60
- IPC: H01L33/60
Abstract:
A light emitting diode (LED) package and a manufacturing method thereof are provided. The LED package includes a substrate including a circuit layer, an LED mounted on the substrate, and a plurality of protruded reflection units disposed in a region excluding an LED mounting region on the substrate and configured to reflect light generated from the LED.
Public/Granted literature
- US08933474B2 Light emitting diode package and manufacturing method thereof Public/Granted day:2015-01-13
Information query
IPC分类:
