发明申请
- 专利标题： CAMERA MODULE, AND MANUFACTURING DEVICE AND METHOD FOR THE SAME
- 专利标题（中）： 相机模块及其制造装置及其制造方法
-
申请号： US13545499申请日： 2012-07-10
-
公开(公告)号： US20130033639A1公开(公告)日： 2013-02-07
- 发明人: Toshiaki IWAFUCHI , Toshihiro Furusawa , Yoshihito Higashitsutsumi
- 申请人： Toshiaki IWAFUCHI , Toshihiro Furusawa , Yoshihito Higashitsutsumi
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2011-168024 20110801
- 主分类号： H04N5/225
- IPC分类号： H04N5/225 ; H05K13/00
摘要：
A camera module includes an imaging sensor, a power feed electrode, a first conductive member, and a first sealing member. The imaging sensor includes a light-receiving surface receiving light gathered by a lens. The power feed electrode is formed to a surface including the light receiving-surface of the imaging sensor, and the power feed electrode is configured to make a power feed. The first conductive member is configured to electrically connect the power feed electrode and a drive electrode. The drive electrode is provided to a drive section configured to drive the lens in accordance with the power feed. The first sealing member is formed by sealing the first conductive member.
公开/授权文献
信息查询
