Invention Application
US20130034725A1 CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM
有权
具有改进粘合剂的电路材料，其制造方法及其形成的制品
- Patent Title: CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM
- Patent Title (中): 具有改进粘合剂的电路材料，其制造方法及其形成的制品
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Application No.: US13649333Application Date: 2012-10-11
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Publication No.: US20130034725A1Publication Date: 2013-02-07
- Inventor: Sankar K. Paul
- Applicant: World Properties, Inc.
- Applicant Address: US IL Lincolnwood
- Assignee: WORLD PROPERTIES, INC.
- Current Assignee: WORLD PROPERTIES, INC.
- Current Assignee Address: US IL Lincolnwood
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B32B15/06 ; B32B33/00 ; B32B15/085
Abstract:
A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer.
Public/Granted literature
- US08722192B2 Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom Public/Granted day:2014-05-13
Information query
