Invention Application
- Patent Title: HONEYCOMB STRUCTURE
- Patent Title (中): 蜂窝结构
-
Application No.: US13591494Application Date: 2012-08-22
-
Publication No.: US20130036719A1Publication Date: 2013-02-14
- Inventor: Yasushi NOGUCHI , Atsushi KANEDA , Takayuki INOUE
- Applicant: Yasushi NOGUCHI , Atsushi KANEDA , Takayuki INOUE
- Applicant Address: JP Nagoya-City
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya-City
- Priority: JP2010-041814 20100226
- Main IPC: B01D39/20
- IPC: B01D39/20

Abstract:
The honeycomb structure is provided with a honeycomb structural section, a pair of lateral electrodes on the side face of the honeycomb structural section, and at least one intermediate layer between the honeycomb structural section and the lateral electrodes. The honeycomb structural section has silicon carbide particles having an average particle diameter of 3 to 40 μm and silicon, and the ratio (Si/SiC) of silicon (Si) to silicon carbide (SiC) is 10/90 to 40/60. The lateral electrodes have an average particle diameter of the silicon carbide particles of 10 to 70 μm and a Si/SiC ratio of 20/80 to 50/50. The intermediate layer has an average particle diameter of silicon carbide particles and Si/SiC between those of the honeycomb structural section and those of the lateral electrodes. The electric resistance between the lateral electrodes of the honeycomb structural section is 2 to 100Ω.
Public/Granted literature
- US08535405B2 Honeycomb structure Public/Granted day:2013-09-17
Information query