Invention Application
- Patent Title: LIGHT EMITTING DIODE CHIP
- Patent Title (中): 发光二极管芯片
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Application No.: US13654169Application Date: 2012-10-17
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Publication No.: US20130037801A1Publication Date: 2013-02-14
- Inventor: Masayoshi KOIKE , Bum Joon KIM
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Seoul
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Seoul
- Priority: KR10-2006-36372 20060421
- Main IPC: H01L33/02
- IPC: H01L33/02 ; H01L33/62
Abstract:
A light emitting diode (LED) chip including: a substrate; and a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, sequentially deposited on the substrate, in which when a length of the substrate is L and a width of the substrate is W, L/W>10.
Information query
IPC分类:
