发明申请
- 专利标题： SEMICONDUCTOR PACKAGE AND STACK-TYPE SEMICONDUCTOR PACKAGE HAVING THE SAME
- 专利标题（中）： 半导体封装和堆叠型半导体封装
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申请号： US13334515申请日： 2011-12-22
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公开(公告)号： US20130037939A1公开(公告)日： 2013-02-14
- 发明人: Gyujei LEE , Kang Won LEE
- 申请人： Gyujei LEE , Kang Won LEE
- 申请人地址： KR Icheon-si
- 专利权人： HYNIX SEMICONDUCTOR INC.
- 当前专利权人： HYNIX SEMICONDUCTOR INC.
- 当前专利权人地址： KR Icheon-si
- 优先权： KR10-2011-0078852 20110809
- 主分类号： H01L23/498
- IPC分类号： H01L23/498
摘要：
A semiconductor package includes a semiconductor chip having a first surface, a second surface which faces away from the first surface, and through holes which pass through the first surface and the second surface; a dielectric layer formed on one or more of the first surface and the second surface and formed with grooves around the through holes on a fourth surface of the dielectric layer facing away from a third surface of the dielectric layer which is attached to the semiconductor chip; through-silicon vias filling the through holes; and bumps formed on the through-silicon vias and on portions of the dielectric layer around the through-silicon vias and filling the grooves.
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