公开(公告)号：US09087819B2

公开(公告)日：2015-07-21

申请号：US13334515

申请日：2011-12-22

申请人： Gyujei Lee ,  Kang Won Lee

发明人： Gyujei Lee ,  Kang Won Lee

IPC分类号： H01L23/48 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L23/52 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L23/481 ,  H01L23/293 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/52 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/13009 ,  H01L2224/13014 ,  H01L2224/13018 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/16237 ,  H01L2224/29099 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014

摘要： A semiconductor package includes a semiconductor chip having a first surface, a second surface which faces away from the first surface, and through holes which pass through the first surface and the second surface; a dielectric layer formed on one or more of the first surface and the second surface and formed with grooves around the through holes on a fourth surface of the dielectric layer facing away from a third surface of the dielectric layer which is attached to the semiconductor chip; through-silicon vias filling the through holes; and bumps formed on the through-silicon vias and on portions of the dielectric layer around the through-silicon vias and filling the grooves.

摘要翻译： 半导体封装包括具有第一表面，远离第一表面的第二表面和穿过第一表面和第二表面的通孔的半导体芯片; 电介质层，其形成在所述第一表面和所述第二表面的一个或多个上，并且在所述电介质层的第四表面上的所述通孔周围形成有与所述电介质层的附接到所述半导体芯片的第三表面相背离的沟槽; 通孔通孔填充通孔; 以及形成在穿硅通孔上的电介质层的部分上的凸起，并且填充沟槽。

公开(公告)号：US20130037939A1

公开(公告)日：2013-02-14

申请号：US13334515

申请日：2011-12-22

申请人： Gyujei LEE ,  Kang Won LEE

发明人： Gyujei LEE ,  Kang Won LEE

IPC分类号： H01L23/498

CPC分类号： H01L23/481 ,  H01L23/293 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/52 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/13009 ,  H01L2224/13014 ,  H01L2224/13018 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/16237 ,  H01L2224/29099 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014

摘要： A semiconductor package includes a semiconductor chip having a first surface, a second surface which faces away from the first surface, and through holes which pass through the first surface and the second surface; a dielectric layer formed on one or more of the first surface and the second surface and formed with grooves around the through holes on a fourth surface of the dielectric layer facing away from a third surface of the dielectric layer which is attached to the semiconductor chip; through-silicon vias filling the through holes; and bumps formed on the through-silicon vias and on portions of the dielectric layer around the through-silicon vias and filling the grooves.

摘要翻译： 半导体封装包括具有第一表面，远离第一表面的第二表面和穿过第一表面和第二表面的通孔的半导体芯片; 电介质层，其形成在所述第一表面和所述第二表面的一个或多个上，并且在所述电介质层的第四表面上的所述通孔周围形成有与所述电介质层的附接到所述半导体芯片的第三表面相背离的沟槽; 通孔通孔填充通孔; 以及形成在穿硅通孔上的电介质层的部分上的凸起，并且填充沟槽。

公开(公告)号：US20120127660A1

公开(公告)日：2012-05-24

申请号：US13298512

申请日：2011-11-17

申请人： Kang Won LEE ,  Hyun Joo KIM ,  Gyujei LEE

发明人： Kang Won LEE ,  Hyun Joo KIM ,  Gyujei LEE

IPC分类号： H05K7/20 ,  H05K3/30 ,  H05K1/11 ,  H05K1/02 ,  H05K1/18

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/563 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/473 ,  H01L23/4985 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/051 ,  H01L2224/056 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/11444 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/131 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/27 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/32013 ,  H01L2224/32058 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/8185 ,  H01L2224/81902 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1515 ,  H01L2924/181 ,  H05K1/189 ,  H05K2201/051 ,  Y10T29/49139 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Cylindrical packages are provided. The cylindrical package includes a cylindrical substrate having a hollow region therein and at least one semiconductor chip mounted on an outer circumference of the cylindrical substrate. Related electronic products and related fabrication methods are also provided.

摘要翻译： 提供圆柱形包装。 圆柱形封装包括其中具有中空区域的圆柱形衬底和安装在圆柱形衬底的外圆周上的至少一个半导体芯片。 还提供了相关的电子产品和相关的制造方法。