- 专利标题: MULTIPLE DIE IN A FACE DOWN PACKAGE
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申请号: US13209596申请日: 2011-08-15
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公开(公告)号: US20130043582A1公开(公告)日: 2013-02-21
- 发明人: Belgacem Haba , Wael Zohni , Richard Dewitt Crisp
- 申请人: Belgacem Haba , Wael Zohni , Richard Dewitt Crisp
- 申请人地址: US CA San Jose
- 专利权人: TESSERA, INC.
- 当前专利权人: TESSERA, INC.
- 当前专利权人地址: US CA San Jose
- 主分类号: H01L23/482
- IPC分类号: H01L23/482
摘要:
A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.
公开/授权文献
- US08569884B2 Multiple die in a face down package 公开/授权日:2013-10-29