发明申请
- 专利标题： BIOCHIP STAMPING DEVICE AND STAMPING METHOD THEREOF
- 专利标题（中）： BIOCHIP冲压装置及其冲压方法
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申请号： US13358880申请日： 2012-01-26
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公开(公告)号： US20130047399A1公开(公告)日： 2013-02-28
- 发明人: Sang Youl JEON , Bo Sung Ku , Hee Ju Son
- 申请人： Sang Youl JEON , Bo Sung Ku , Hee Ju Son
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权： KR10-2011-0086521 20110829
- 主分类号： B23P19/04
- IPC分类号： B23P19/04 ; B23P11/00 ; B23P17/04 ; B23P19/10
摘要：
There is provided a biochip stamping device. The biochip stamping device includes a stamping jig in which a first biochip is aligned; an inverting mechanism vertically inverting a second biochip; and a movement mechanism transferring the vertically inverted second biochip on the stamping jig to combine the first biochip and the second biochip.
公开/授权文献
- US08765078B2 Biochip stamping device and stamping method thereof 公开/授权日：2014-07-01