发明申请
- 专利标题: LAMINATED AND SINTERED CERAMIC CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE INCLUDING THE CIRCUIT BOARD
- 专利标题(中): 层压和烧结陶瓷电路板,以及包括电路板的半导体封装
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申请号: US13331253申请日: 2011-12-20
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公开(公告)号: US20130049202A1公开(公告)日: 2013-02-28
- 发明人: Makoto TANI , Takami Hirai , Shinsuke Yano , Daishi Tanabe
- 申请人: Makoto TANI , Takami Hirai , Shinsuke Yano , Daishi Tanabe
- 申请人地址: JP Nagoya-City
- 专利权人: NGK Insulators, Ltd.
- 当前专利权人: NGK Insulators, Ltd.
- 当前专利权人地址: JP Nagoya-City
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H05K1/09 ; H05K1/00
摘要:
In the laminated and sintered ceramic circuit board according to the present invention, at least a portion of the inplane conductor is fine-lined, such that the shape of the cross-section surface of the fine-lined inplane conductor is trapezoid, and the height (a), the length (c) of the lower base and the length (d) of the upper base of the trapezoidal cross-section surfaces, and the interval (b) between the lower bases of the trapezoidal cross-section surfaces of the inplane conductors adjacent in a plane parallel to the principal surfaces of the board meet a certain relation. This provides a laminated ceramic circuit hoard with low open failure rate, short-circuit failure rate and high reliability against high temperature and high humidity in a downsized and short-in-height (thin) semiconductor package.