LAMINATED AND SINTERED CERAMIC CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE INCLUDING THE CIRCUIT BOARD
    1.
    发明申请
    LAMINATED AND SINTERED CERAMIC CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE INCLUDING THE CIRCUIT BOARD 有权
    层压和烧结陶瓷电路板,以及包括电路板的半导体封装

    公开(公告)号:US20130049202A1

    公开(公告)日:2013-02-28

    申请号:US13331253

    申请日:2011-12-20

    IPC分类号: H01L23/48 H05K1/09 H05K1/00

    摘要: In the laminated and sintered ceramic circuit board according to the present invention, at least a portion of the inplane conductor is fine-lined, such that the shape of the cross-section surface of the fine-lined inplane conductor is trapezoid, and the height (a), the length (c) of the lower base and the length (d) of the upper base of the trapezoidal cross-section surfaces, and the interval (b) between the lower bases of the trapezoidal cross-section surfaces of the inplane conductors adjacent in a plane parallel to the principal surfaces of the board meet a certain relation. This provides a laminated ceramic circuit hoard with low open failure rate, short-circuit failure rate and high reliability against high temperature and high humidity in a downsized and short-in-height (thin) semiconductor package.

    摘要翻译: 在根据本发明的层压和烧结陶瓷电路板中,面内导体的至少一部分被精细地排列,使得细衬面内导体的横截面的形状是梯形,并且高度 (a)中,梯形截面的下基部的长度(c)和上基部的长度(d)以及梯形截面的梯形截面的下基座之间的间隔(b) 在与板的主表面平行的平面中相邻的面内导体满足一定关系。 这提供了在小型和短路(薄)半导体封装中具有低开路故障率,短路故障率和高温和高湿度的高可靠性的层压陶瓷电路板。

    LAMINATED AND SINTERED CERAMIC CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE INCLUDING THE CIRCUIT BOARD
    2.
    发明申请
    LAMINATED AND SINTERED CERAMIC CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE INCLUDING THE CIRCUIT BOARD 有权
    层压和烧结陶瓷电路板,以及包括电路板的半导体封装

    公开(公告)号:US20130026636A1

    公开(公告)日:2013-01-31

    申请号:US13237259

    申请日:2011-09-20

    IPC分类号: H01L23/498 H05K1/09 H05K1/00

    摘要: A circuit board that can decrease thermal stress acting between a semiconductor element and a board in association with temperature alteration and has high mechanical strength (rigidity) as a whole board (including a multilayer wiring layer) is provided. Ceramic base material having a coefficient of thermal expansion close to that of a semiconductor element and inner layer wiring are integrally sintered, and the circuit board is configured so that fine-lined conductor structure corresponding to a multilayer wiring layer in the inner layer wiring has predetermined width, intralayer interval and interlayer interval. Thereby, thermal stress acting between a semiconductor element and the board when the board is exposed to temperature alteration in a condition where it is joined with the semiconductor element is suppressed, rigidity of the board is maintained, and its reliability against temperature cycle is increased.

    摘要翻译: 提供了可以降低与温度变化相关联地在半导体元件和板之间作用的热应力并且具有作为整个板(包括多层布线层)的高机械强度(刚性)的电路板。 具有与半导体元件和内层布线接近的热膨胀系数的陶瓷基材一体烧结,并且电路板被构造成使得与内层布线中的多层布线层相对应的细线导体结构具有预定的 宽度,内膜间隔和层间间隔。 因此,抑制了在与半导体元件接合的状态下板暴露于温度变化时半导体元件与基板之间的热应力,保持板的刚性,并且提高其对温度循环的可靠性。

    PIEZOELECTRIC ACTUATOR AND PIEZOELECTRIC ACTUATOR ARRAY
    3.
    发明申请
    PIEZOELECTRIC ACTUATOR AND PIEZOELECTRIC ACTUATOR ARRAY 失效
    压电致动器和压电致动器阵列

    公开(公告)号:US20120223619A1

    公开(公告)日:2012-09-06

    申请号:US13408253

    申请日:2012-02-29

    申请人: Makoto TANI

    发明人: Makoto TANI

    IPC分类号: H01L41/04

    摘要: A piezoelectric actuator 10 according to each embodiment of the present invention comprises: a column-like piezoelectric body 31, whose bottom face is fixed to a base portion 20, and which stands from the base portion; and a driving power supply section for applying a driving voltage to the piezoelectric body. The piezoelectric body includes two sets (32, 33) of a pair of electrodes for providing electrical fields to the piezoelectric body. The two sets are formed so that each of the two sets is provided to each of two regions into which the piezoelectric body is divided by a virtual plane VPL1 parallel to the center axis CL of the piezoelectric body. The driving power supply section applies the driving voltage Vin having a “frequency between the second-order bending resonant frequency and the first-order expansion-contraction resonant frequency” to either one of the two sets, selectively.

    摘要翻译: 根据本发明的每个实施例的压电致动器10包括:柱状压电体31,其底面固定到基部20,并且从基部支撑; 以及用于向压电体施加驱动电压的驱动电源部。 压电体包括用于向压电体提供电场的一对电极的两组(32,33)。 两组被形成为使得两组中的每一个被设置到两个区域中,压电体被平行于压电体的中心轴线CL的虚拟平面VPL1划分成两个区域。 驱动电源部分选择性地将具有“二阶弯曲共振频率与一阶扩展 - 收缩共振频率之间的频率”的驱动电压Vin施加到两组之一。

    PIEZOELECTRIC ACTUATOR AND PIEZOELECTRIC ACTUATOR ARRAY
    4.
    发明申请
    PIEZOELECTRIC ACTUATOR AND PIEZOELECTRIC ACTUATOR ARRAY 有权
    压电致动器和压电致动器阵列

    公开(公告)号:US20120217844A1

    公开(公告)日:2012-08-30

    申请号:US13405717

    申请日:2012-02-27

    申请人: Makoto TANI

    发明人: Makoto TANI

    IPC分类号: H01L41/09

    摘要: An aspect of a piezoelectric actuator according to the present invention comprises: a plate-like piezoelectric element (20); a sheet (30); and a movable body (50). The piezoelectric element is provided to the sheet (30) in such a manner that the upper surface of the plate-like piezoelectric element is parallel to the upper surface of the sheet. The sheet includes a movable body driving section (40) formed on one of the upper and the lower surfaces of the sheet. A movable body includes a contact section (51) contacting with the sheet at the movable body driving section. The actuator moves the movable body driving section in a direction parallel to the upper surface of the sheet by using expansion and contraction of the piezoelectric element in a direction parallel to the upper surface of the piezoelectric element to move the movable body.

    摘要翻译: 根据本发明的压电致动器的一个方面包括:板状压电元件(20); 片(30); 和移动体(50)。 压电元件以板状压电元件的上表面平行于片材的上表面的方式设置在片材(30)上。 片材包括形成在片材的上表面和下表面中的一个上的可移动体驱动部分(40)。 可移动体包括在可移动体驱动部分处与片材接触的接触部分(51)。 致动器通过使压电元件在与压电元件的上表面平行的方向上的伸缩来移动可移动体驱动部,该方向与片材的上表面平行的方向移动。